Manufacturing and Reliability Challenges With QFN - American ...

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Knowledge and Education (Website) o Let your staff learn all day / every day o o o o o E-LEARNING Scholarly articles Technical white papers Case studies Reliability calculators Online presentations 8 8
QFN as a ‘Next Generation’ Technology o o o What is „Next Generation‟ Technology? o Materials or designs currently being used, but not widely adopted (especially among hi-rel manufacturers) Carbon nanotubes are not „Next Generation‟ o Not used in electronic applications Ball grid array is not „Next Generation‟ o Widely adopted 9 9
Page 1 and 2: Manufacturing and Reliability Chall
Page 3 and 4: DfR Solutions works with companies
Page 5 and 6: DfR Clients o o o o o o o o o o o o
Page 7: DfR Resources and Equipment Electri
Page 11 and 12: Reliability and Next Generation Tec
Page 13 and 14: Component Testing o o o Reliability
Page 15 and 16: Solder Wearout in Next Generation P
Page 17 and 18: Solder Wearout (cont.) o o Design c
Page 19 and 20: Industry Response to SJ Wearout? o
Page 21 and 22: Quad Flat Pack No Leads or Quad Fla
Page 23 and 24: QFN Advantages: Size and Cost o o S
Page 25 and 26: Advantages: Thermal Performance o o
Page 27 and 28: QFN: Why Not? o o QFN is a „next
Page 29 and 30: o Increase component standoff throu
Page 31 and 32: Manufacturability: Stencil Design o
Page 33 and 34: Manufacturability: Reflow & Moistur
Page 35 and 36: Manufacturability: QFN Joint Inspec
Page 37 and 38: Manufacturability: QFN Joint Inspec
Page 39 and 40: Manufacturability: Rework o o o Can
Page 41 and 42: Pad Cratering • Cracking initiati
Page 43 and 44: Solutions to Pad Cratering o Board
Page 45 and 46: Thermal Cycling: Conformal Coating
Page 47 and 48: Reliability: Dendritic Growth / Ele
Page 49 and 50: Dendritic Growth (cont.) o Componen
Page 51 and 52: Cleanliness Recommendations Ion Con
Page 53 and 54: Thank you! Any Questions? Contact m

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