Manufacturing and Reliability Challenges With QFN - American ...

Pad Cratering
Intel (2006)
o
Drivers
o
o
o
o
Finer pitch components
More brittle laminates
Stiffer solders (SAC vs. SnPb)
Presence of a large heat sink
o
Difficult to detect using
standard procedures
o
X-ray, dye-n-pry, ball shear, and
ball pull
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