Manufacturing and Reliability Challenges With QFN - American ...

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Manufacturability: <strong>QFN</strong> Joint Inspection 36 36
Manufacturability: <strong>QFN</strong> Joint Inspection Convex or absence of fillet highly likely •Etching of leadframe can prevent pad from reaching edge of package •Edge of bond pad is not plated for solderability 37 37
Page 1 and 2: Manufacturing and Reliability Chall
Page 3 and 4: DfR Solutions works with companies
Page 5 and 6: DfR Clients o o o o o o o o o o o o
Page 7 and 8: DfR Resources and Equipment Electri
Page 9 and 10: QFN as a ‘Next Generation’ Tech
Page 11 and 12: Reliability and Next Generation Tec
Page 13 and 14: Component Testing o o o Reliability
Page 15 and 16: Solder Wearout in Next Generation P
Page 17 and 18: Solder Wearout (cont.) o o Design c
Page 19 and 20: Industry Response to SJ Wearout? o
Page 21 and 22: Quad Flat Pack No Leads or Quad Fla
Page 23 and 24: QFN Advantages: Size and Cost o o S
Page 25 and 26: Advantages: Thermal Performance o o
Page 27 and 28: QFN: Why Not? o o QFN is a „next
Page 29 and 30: o Increase component standoff throu
Page 31 and 32: Manufacturability: Stencil Design o
Page 33 and 34: Manufacturability: Reflow & Moistur
Page 35: Manufacturability: QFN Joint Inspec
Page 39 and 40: Manufacturability: Rework o o o Can
Page 41 and 42: Pad Cratering • Cracking initiati
Page 43 and 44: Solutions to Pad Cratering o Board
Page 45 and 46: Thermal Cycling: Conformal Coating
Page 47 and 48: Reliability: Dendritic Growth / Ele
Page 49 and 50: Dendritic Growth (cont.) o Componen
Page 51 and 52: Cleanliness Recommendations Ion Con
Page 53 and 54: Thank you! Any Questions? Contact m

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