Manufacturing and Reliability Challenges With QFN - American ...
Manufacturing and Reliability Challenges With QFN - American ...
Manufacturing and Reliability Challenges With QFN - American ...
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Characteristic Life (Cycles to Failure)<br />
Solder Wearout (cont.)<br />
o<br />
Hotter devices<br />
o<br />
Increases change in temperature (DT)<br />
10000<br />
t f = DT n<br />
9000<br />
8000<br />
7000<br />
n = 2 (SnPb)<br />
n = 2.3 (SnNiCu)<br />
n = 2.7 (SnAgCu)<br />
6000<br />
5000<br />
4000<br />
3000<br />
2000<br />
1000<br />
0<br />
0 50 100 150 200<br />
Change in Temperature ( o C)<br />
18<br />
18
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