Sales policy for domestic USA customers.

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Compression Mounting Compounds Tips, Tricks & Techniques: For best performance of your mounting press and media: ■ Do not compression mount soft, low melting point alloys, wood, plastic or very friable materials. Castable mounting media will provide better results. ■ Apply Release Agent 20-8185-002 to mold for easy removal. ■ To permanently label specimens when using opaque mount media, fill most of the mold cylinder with mount media before adding a thin layer of TransOptic media. Place a typed label over the TransOptic powder, then cover it with a second layer of TransOptic powder. When cured, this preserves the label in a clear layer of media for easy sample identification. ■ To eliminate ”cotton balls” in TransOptic mounts, increase cool time and/or reduce molding temperature for improved mount clarity. ■ Reheating TransOptic mounts to 110 °C for 15 – 30 minutes will allow for the removal of the sample. Wearing heat-resistant gloves, apply pressure to the media near the sample with pliers. This should flex the mount, allowing the media to break away from the sample with increasing pressure. ■ Mounting samples off-center for EBSD evaluation facilitates beam positioning. Troubleshooting: ■ Mount media that appears frosted or unfused from the mounting press is often a sign of insufficient molding temperatures. Check to ensure the temperature setting on the mounting press is 150 °C or higher and that the heating element is tightened on the mold cylinder. For the SimpliMet® 1000 and 3000 Mounting Presses, this is done by turning the cylinder locking screw counter-clockwise until the screw is loose. ■ Uncured mounts can be caused by too much moisture in the media. Ensure that containers are properly closed between uses. ■ Ensure that enough mounting media is placed into mold to sufficiently cover the sample. If not enough mount media is used, the mounting media may not be compressed enough to cure properly and could cause damage to the mold cylinders and ram assembly. ■ Radial splitting of cured mounts is often caused by samples with sharp corners or those that are too large for the mold size. Reducing sample size and/or grinding off sharp corners is recommended. ■ Excessive shrinkage is related to the thermal expansion coefficient of the media and can be minimized by fully cooling specimens under pressure in the mounting press. To minimize shrinkage, the specimen should be cooled to room temperature before removal from the mounting press. Looking to Control the Mounting Pressures of Everyday Sample Preparation? Let Buehler help. Our SimpliMet® Family of Mounting Presses offer: • Easy-to-use hot compression mounting equipment • Manual or semi-automatic operation • Simple analog controls or membrane keypads with LCD display • Interchangeable 1”- 2” (25mm - 50mm) mold sizes • Duplex spacer allows two mounts in a single cycle • Quick and safe bayonet mold closure system • Automatic programmability available Buehler also offers a complete line of sample preparation equipment. From abrasive cutters to precision saws to grinder-polishers, Buehler has it all! For more information, contact your local Buehler Sales Engineer or visit our website at www.buehler.com/productinfo/presses.htm We are Buehler - the science behind materials preparation and analysis! 12 Effective 2011
Compression Mounting Compounds Product Overview: Mounting Material General Characteristics Best Used For Advantages/Cautions PhenoCure® Diallyl Phthlate • Wood-Flour Filled phenolic thermoset • Fast Cure • Moderate Shrinkage and Edge Retention • Available in red, black or green • Glass or Mineral (TiO2) filled resin thermoset • Moderate edge retention • Low Shrinkage • Bright Blue Color • General Metallography where edge retention and media hardness are not critical • General Metallography where edge retention is not critical and a more abrasion-resistant media is desired • Most Economical Choice • Least sensitive to pressure variations during curing • Glass filled version is better for etching • Mineral filled version is harder Mounting EpoMet® • Mineral (SiO2) filled epoxy thermoset • Available in G (Granular) or F (Fine) particle sizes • Best edge retention, highest hardness and abrasionresistance in this class • Available in black • Preserving edge information such as decarburization or coating thickness • Mounting very hard materials such as hardened steel or ceramics • EpoMet® G Mounting Media is recommended for the best quality mounts in everyday metallography. • EpoMet® F Mounting Media is recommended for materials that have fine features that the smaller grains will flow around ProbeMet® • Copper (Cu) and Mineral (SiO2) filled epoxy thermoset • Conductive • Very good edge retention • Golden Color • Characterization of samples using SEM when Cu is not the object of analysis • Can cause a Cu-Al galvanic couple when vibratory polishing is performed on an Al specimen. In this case, use KonductoMet® Mounting Media. KonductoMet® • Graphite and Mineral ( SiO2) filled phenolic thermoset • Conductive • Higher hardness than ProbeMet® Media • Moderate edge retention • Available in black • Characterization of samples using SEM when carbon is not the object of analysis • Use when Cu in the mounting media is not acceptable due to analysis of copper in the sample material. TransOptic • Thermoplastic acrylic • Contains no filler • Transparent and relatively soft when properly cured • General metallography where edge information is not critical and where transparency of the mount is useful • Removal of samples from mount is necessary • Requires longer cycle times to fully cool, thus preventing the “cotton ball” effect Effective 2011 13
Page 3 and 4: Ordering Information ORDER BY PHONE
Page 5 and 6: Abrasive Cut-Off Wheels Abrasive Cu
Page 7 and 8: Abrasive Cut-Off Wheels Wheel Choic
Page 9 and 10: Abrasive Cut-Off Wheels 18“ (455m
Page 11 and 12: IsoCut® Wafering Blades & Buehler
Page 13: PetroThin® & Lapro® Sectioning Su
Page 17 and 18: Compression Mounting Compounds Phen
Page 19 and 20: Castable Mounting Compounds Epoxy S
Page 21 and 22: Castable Mounting Compounds Ring Fo
Page 23 and 24: Castable Mounting Accessories Casta
Page 25 and 26: Mounting Accessories Miscellaneous
Page 27 and 28: Diamond Grinding Discs Apex® Quick
Page 29 and 30: Diamond Grinding Discs Apex® Diamo
Page 31 and 32: Diamond Grinding Discs UltraPrep Re
Page 33 and 34: Abrasive Discs CarbiMet® 2 Abrasiv
Page 35 and 36: Abrasive Discs BuehlerMet® II Abra
Page 37 and 38: Abrasive Lapping Film FibrMet® Abr
Page 39 and 40: Abrasive Powders Silicon Carbide an
Page 41 and 42: Polishing Cloths Polishing Cloths B
Page 43 and 44: Grinding/Polishing Consumables Meta
Page 45 and 46: Grinding/Polishing Accessories Grin
Page 47 and 48: Grinding/Polishing Consumables Micr
Page 49 and 50: Spare Bulbs for Microscopes, Metall
Page 51 and 52: Hardness Calibration Test Blocks Mi
Page 53 and 54: Buehler Education Schedule Educatio
Page 55 and 56: Buehler Education Schedule 2011 SCH
Page 57 and 58: Index A Abrasive Cut-off Wheels . .
Page 59 and 60: BUEHLER ® Worldwide Sales Offices

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