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Buehler Education Schedule CALCE (Center for Advanced Life Cycle Engineering - University of Maryland) / Buehler Failure Analysis of Electronic Components CALCE / BUEHLER FAILURE ANALYSIS OF ELECTRONIC COMPONENTS Failure analysis is an important tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Significant improvements in the reliability of electronics can be achieved by retrieving products and examining them to determine the root cause of any failures and the extent of degradation which has occurred over time. Root cause failure analysis employs a sequence of non-destructive and destructive analytical techniques to characterize the modes by which failure is manifested, the sites where failure is localized, the fundamental mechanical, electrical, chemical and electrochemical mechanisms by which failure has occurred, and the factors which precipitated the activation of those mechanisms. Unfortunately, failure analysis is often performed incorrectly or incompletely, leading to a poor understanding of failure mechanisms and causes, and loss of money, customers, and possibly lives due to recurrence of failures. The first half of the short course will present a methodology for identifying potential failure mechanisms in electronic components based on the failure history. Systematic approaches to root cause analysis will be provided. Failure analysis techniques geared towards various failure mechanisms will be discussed, with an emphasis on cross-sectioning techniques and analysis. Cross-sectional analysis is a valuable tool for failure analysis of electronic devices along with quality evaluation, research and process monitoring. Successful use of this technique is often complicated by the highly dissimilar properties of the component materials under investigation and their susceptibility to damage. Emphasis will be placed on how to deal with these differences through an understanding of the component materials to be prepared and the basic principles of abrasive grinding and polishing. Techniques for low-damage sectioning and the procedures required to prevent preparation induced damage are discussed. The second half of this short course provides guidance on how to choose preparation sequences depending on the materials, the configuration of the specimens and the ultimate purpose of the investigation. The short course stresses the need to understand the basic principles rather than simply following '“recipes". The goal of specimen preparation is to produce a damage-free surface that can be imaged and analyzed through the use of microscopy. Methods for capturing images and quantifying features through the use of image analysis will be discussed and demonstrated. This course is recommended for persons who wish to conduct failure analysis on electronic products such as PWBs, wafers, solid state devices and components. This course will be taught jointly by Center for Advanced Life Cycle Engineering (CALCE) and Buehler. April 26-29, 2011 (CALCE - University of Maryland) September 13-16, 2011 (CALCE - University of Maryland) COST: 4-day course: $2500 Consortium Members & Government Institutions: $2000 Each attendee is invited to submit one sample to CALCE at least three weeks before the start date. Several of the submitted samples will be prepared and analyzed in advance, for use during the demonstrations. Other samples will be used for hands-on training to illustrate specimen preparation procedures and analysis techniques. However, no guarantee can be offered that any specific sample will be used. All unused samples will be returned. For course registration information please contact Bhanu Sood by phone at 301-405-3498 or by email at bpsood@calce.umd.edu. 52 Effective 2011
Buehler Education Schedule 2011 SCHEDULE AT A GLANCE COURSE JAN FEB MAR APR MAY JUN JUL AUG SEP OCT NOV/DEC INSTITUTE FOR MICROSTRUCTURAL ANALYSIS (USA) Metallographic Apr Aug Nov 29 - Dec 1 Techniques 5-7 2-4 Practical Applications Mar Sep of Automatic 22-23 20-21 Image Analysis CALCE (CENTER OF ADVANCED LIFE CYCLE ENGINEERING - UNIVERSITY OF MARYLAND) / BUEHLER FAILURE ANALYSIS OF ELECTRONIC COMPONENTS CALCE / Buehler Failure Apr Sep Analysis of Electronic 26-29 13-16 Components Course schedules and locations are subject to change depending on level of participation. Pricing is subject to change. For an updated schedule and registration form, visit our website at www.buehler.com. Serial Number Month Codes Buehler’s International Serial Number Month Codes A Month code can be found on most consumable labels. The code represents the corresponding month and year of manufacture. Year Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec 2007 637 638 639 640 641 642 643 644 645 646 647 648 2008 649 650 651 652 653 654 655 656 657 658 659 660 2009 661 662 663 664 665 666 667 668 669 670 671 672 2010 673 674 675 676 677 678 679 680 681 682 683 684 2011 685 686 687 688 689 690 691 692 693 694 695 696 Education Schedule Effective 2011 53
Page 3 and 4: Ordering Information ORDER BY PHONE
Page 5 and 6: Abrasive Cut-Off Wheels Abrasive Cu
Page 7 and 8: Abrasive Cut-Off Wheels Wheel Choic
Page 9 and 10: Abrasive Cut-Off Wheels 18“ (455m
Page 11 and 12: IsoCut® Wafering Blades & Buehler
Page 13 and 14: PetroThin® & Lapro® Sectioning Su
Page 15 and 16: Compression Mounting Compounds Prod
Page 17 and 18: Compression Mounting Compounds Phen
Page 19 and 20: Castable Mounting Compounds Epoxy S
Page 21 and 22: Castable Mounting Compounds Ring Fo
Page 23 and 24: Castable Mounting Accessories Casta
Page 25 and 26: Mounting Accessories Miscellaneous
Page 27 and 28: Diamond Grinding Discs Apex® Quick
Page 29 and 30: Diamond Grinding Discs Apex® Diamo
Page 31 and 32: Diamond Grinding Discs UltraPrep Re
Page 33 and 34: Abrasive Discs CarbiMet® 2 Abrasiv
Page 35 and 36: Abrasive Discs BuehlerMet® II Abra
Page 37 and 38: Abrasive Lapping Film FibrMet® Abr
Page 39 and 40: Abrasive Powders Silicon Carbide an
Page 41 and 42: Polishing Cloths Polishing Cloths B
Page 43 and 44: Grinding/Polishing Consumables Meta
Page 45 and 46: Grinding/Polishing Accessories Grin
Page 47 and 48: Grinding/Polishing Consumables Micr
Page 49 and 50: Spare Bulbs for Microscopes, Metall
Page 51 and 52: Hardness Calibration Test Blocks Mi
Page 53: Buehler Education Schedule Educatio
Page 57 and 58: Index A Abrasive Cut-off Wheels . .
Page 59 and 60: BUEHLER ® Worldwide Sales Offices

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