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Expanding Multiph<br />

with COMSO<br />

COMSOL Multiphysics ®<br />

COMSOL Version 4.2 expands the scope of multiph<br />

mechanical, chemical, and fl uid simulations, as well as<br />

For details visit: www.comsol.com/4.2<br />

Geometry and Mesh<br />

Time-dependent adaptive meshing and automatic<br />

remeshing tightly link solvers and meshing algorithms<br />

<strong>for</strong> any moving mesh simulations. Models<br />

with moving diffusion fronts are solved more<br />

effi ciently as are simulations involving removal<br />

and deposition of materials. New geometry tools<br />

<strong>for</strong> creating a mesh that only “sees” the essential<br />

parts of the original CAD model enable faster<br />

and more memory-effi cient solving.<br />

AC/DC<br />

Module<br />

RF<br />

Module<br />

MEMS<br />

Module<br />

Heat Transfer<br />

Module<br />

Structural Mechanics<br />

Module<br />

New<br />

Geomechanics<br />

Module<br />

CFD<br />

Modul<br />

Microflui<br />

Modul<br />

Subsurface<br />

Modul<br />

Fast Parallelized Assembly<br />

and Solvers<br />

The COMSOL direct solvers have been multicore<br />

and cluster-enabled <strong>for</strong> several years. With<br />

Version 4.2, the multiphysics assembly algorithms<br />

and iterative solvers are also parallelized, bringing<br />

you faster and more memory-effi cient computations<br />

on virtually any type of computer plat<strong>for</strong>m<br />

from laptop to cluster.<br />

Report Generator<br />

The new Report Generator creates HTML<br />

reports <strong>for</strong> models. The Report Generator is an<br />

integrated part of the model, and you can add<br />

several reports to a model.<br />

Plasma<br />

Module<br />

New Modules<br />

Acoustics<br />

Module<br />

Microfl uidics Module<br />

Easy-to-use tools <strong>for</strong> the study of microfluidic devices<br />

and rarefi ed gas fl ows. Important applications include<br />

simulations of lab-on-a-chip devices, digital microfluidics,<br />

electrokinetic and magnetokinetic devices, inkjets, and<br />

vacuum systems.<br />

COMSOL and COMSOL Multiphysics are registered trademarks of COMSOL AB. Capture the Concept, COMSOL Desktop, and LiveLink are trademarks of COMSOL AB. Parasolid is a registered trademark of Siemens Product Lifecycle Management Software Inc. ACIS and SAT are registered<br />

trademarks of Spatial Corp. Inventor and AutoCAD are registered trademarks of Autodesk, Inc., in the USA and other countries. LiveLink <strong>for</strong> AutoCAD and LiveLink <strong>for</strong> Inventor are not affiliated with, endorsed by, sponsored by, or supported by Autodesk, Inc., and/or its affiliates and/or<br />

subsidiaries. MATLAB is a registered trademark of The Mathworks, Inc. Pro/ENGINEER is a registered trademark of Parametric Technology Corporation or its subsidiaries in the U.S. and in other countries. SolidWorks is a registered trademark of Dassault Systèmes SolidWorks Corp.<br />

➮<br />

Cov ToC + – A<br />

➭<br />

32-33 CN COMSOL Spread Ad 2011.indd 32 5/16/11 2:33 PM

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