Lead Free Soldering - SMTA

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DEFECTS CAUSED BY IMPROPER THERMAL BALANCE Wave Solder Process Thermal Shock Damage LED lead LED Increase Thermal Pad Isolation Balance Number Connections For Component Per Each Plated Through Hole Uniformity Of Trace Size Connection To Component Plated Through Hole
THROUGH-HOLE COMPONENT MOUNTING Leads Should Extend Below Bottom of Board Lead Protrusion: Shorter is Better • Decreased Solder Bridging • Decreased Component Tilting Lead Free Solder: • Lead Length Should Be Even Shorter Than Tin-Lead Solder.
Page 1 and 2: DFX FOR LEAD FREE PROCESSING AND RE
Page 3 and 4: TECHNOLOGY DRIVEN DESIGNS Component
Page 5 and 6: MEET FUNCTIONAL AND LEGISLATIVE REQ
Page 7 and 8: MICRO-VIA DESIGN - RELIABILITY IMPA
Page 9 and 10: LEAD TO HOLE CLEARANCE Lead Angle I
Page 11 and 12: INTERNAL PCB IMPACTS Number of laye
Page 13 and 14: THROUGH HOLE PAD DESIGN Square Pads
Page 15: SOLDER MASK SELECTION IMPACT A Low
Page 19 and 20: Are You Confused About Design For M
Page 21 and 22: SOLDER MASK DESIGN AND FABRICATOR I
Page 23 and 24: IMPACTS OF INTERCONNECT DESIGN Plac
Page 25 and 26: BOTTOM TERMINATE COMPONENT SENSITIV
Page 27 and 28: COMPONENT ISSUES - WARPAGE & THERMA
Page 29 and 30: COMPONENT PAD - THERMAL IMBALANCE S
Page 31 and 32: STENCIL TO PCB ALIGNMENT Smaller co
Page 33 and 34: TIN-LEAD VS LEAD FREE WICKING Depen
Page 35 and 36: TEST POINT AND SUPPORT DISTRIBUTION
Page 37 and 38: EXAMPLE OF EXCESSIVE STRESS BGA Con
Page 39: QUESTIONS 39

Lead Free Soldering - SMTA

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