Lead Free Soldering - SMTA

More documents

Recommendations

Info

WHAT DOES LEAD FREE MEAN TO YOU Original RoHS Directive - Originally 8 Categories RoHS2 Directive: Categories 8 (Medical Devices) & 9 (Monitoring and Control Instrumentation) Are Now In Scope 22-July 2014 – General Medical Devices 22 July 2016 – In Vitro Medical Devices Active Implantable Devices • Out Of Scope At This Time • Review For Inclusion In 2020 Defense Excluded From Specification 2
TECHNOLOGY DRIVEN DESIGNS Component packaging technology trends: • Decrease in size (length, width, thickness) • Increase in functionality (electrical, optical, electrical mechanical and mechanical) • Interconnection density per unit area is increasing (increased number of layers, smaller lines and spaces) • Assembly functional performance is increasing (thermal, mechanical, electrical) Assembly process complexities continue to increase and LEAD FREE Soldered 3
Page 1: DFX FOR LEAD FREE PROCESSING AND RE
Page 5 and 6: MEET FUNCTIONAL AND LEGISLATIVE REQ
Page 7 and 8: MICRO-VIA DESIGN - RELIABILITY IMPA
Page 9 and 10: LEAD TO HOLE CLEARANCE Lead Angle I
Page 11 and 12: INTERNAL PCB IMPACTS Number of laye
Page 13 and 14: THROUGH HOLE PAD DESIGN Square Pads
Page 15 and 16: SOLDER MASK SELECTION IMPACT A Low
Page 17 and 18: THROUGH-HOLE COMPONENT MOUNTING Lea
Page 19 and 20: Are You Confused About Design For M
Page 21 and 22: SOLDER MASK DESIGN AND FABRICATOR I
Page 23 and 24: IMPACTS OF INTERCONNECT DESIGN Plac
Page 25 and 26: BOTTOM TERMINATE COMPONENT SENSITIV
Page 27 and 28: COMPONENT ISSUES - WARPAGE & THERMA
Page 29 and 30: COMPONENT PAD - THERMAL IMBALANCE S
Page 31 and 32: STENCIL TO PCB ALIGNMENT Smaller co
Page 33 and 34: TIN-LEAD VS LEAD FREE WICKING Depen
Page 35 and 36: TEST POINT AND SUPPORT DISTRIBUTION
Page 37 and 38: EXAMPLE OF EXCESSIVE STRESS BGA Con
Page 39: QUESTIONS 39

Lead Free Soldering - SMTA

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?