Lead Free Soldering - SMTA

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TO CLEAN OR NOT TO CLEAN Ability to remove soldering process residues from PCBs may change due to • Component package type • Component size • Solder mask design 34
TEST POINT AND SUPPORT DISTRIBUTION Determines probe accessibility to the various components/nets for the purpose of in-circuit testing and concentrate test probe stress into localized area. • Fixture induced printed circuit board bending during test • Fixture induced bending during functional test from connector mating/unmating. 35
Page 1 and 2: DFX FOR LEAD FREE PROCESSING AND RE
Page 3 and 4: TECHNOLOGY DRIVEN DESIGNS Component
Page 5 and 6: MEET FUNCTIONAL AND LEGISLATIVE REQ
Page 7 and 8: MICRO-VIA DESIGN - RELIABILITY IMPA
Page 9 and 10: LEAD TO HOLE CLEARANCE Lead Angle I
Page 11 and 12: INTERNAL PCB IMPACTS Number of laye
Page 13 and 14: THROUGH HOLE PAD DESIGN Square Pads
Page 15 and 16: SOLDER MASK SELECTION IMPACT A Low
Page 17 and 18: THROUGH-HOLE COMPONENT MOUNTING Lea
Page 19 and 20: Are You Confused About Design For M
Page 21 and 22: SOLDER MASK DESIGN AND FABRICATOR I
Page 23 and 24: IMPACTS OF INTERCONNECT DESIGN Plac
Page 25 and 26: BOTTOM TERMINATE COMPONENT SENSITIV
Page 27 and 28: COMPONENT ISSUES - WARPAGE & THERMA
Page 29 and 30: COMPONENT PAD - THERMAL IMBALANCE S
Page 31 and 32: STENCIL TO PCB ALIGNMENT Smaller co
Page 33: TIN-LEAD VS LEAD FREE WICKING Depen
Page 37 and 38: EXAMPLE OF EXCESSIVE STRESS BGA Con
Page 39: QUESTIONS 39

Lead Free Soldering - SMTA

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