Lead Free Soldering - SMTA

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COMPONENT PAD - THERMAL IMBALANCE “Via in pad” placement may create mounting pad height differences • More of an impact on smaller and/or lower lead count or leadless (no solder ball/solder bump) component packages 30
STENCIL TO PCB ALIGNMENT Smaller components decrease total PCB and assembly process tolerance Minor misalignment can impact process yields 3 mil 6 mil 31
Page 1 and 2: DFX FOR LEAD FREE PROCESSING AND RE
Page 3 and 4: TECHNOLOGY DRIVEN DESIGNS Component
Page 5 and 6: MEET FUNCTIONAL AND LEGISLATIVE REQ
Page 7 and 8: MICRO-VIA DESIGN - RELIABILITY IMPA
Page 9 and 10: LEAD TO HOLE CLEARANCE Lead Angle I
Page 11 and 12: INTERNAL PCB IMPACTS Number of laye
Page 13 and 14: THROUGH HOLE PAD DESIGN Square Pads
Page 15 and 16: SOLDER MASK SELECTION IMPACT A Low
Page 17 and 18: THROUGH-HOLE COMPONENT MOUNTING Lea
Page 19 and 20: Are You Confused About Design For M
Page 21 and 22: SOLDER MASK DESIGN AND FABRICATOR I
Page 23 and 24: IMPACTS OF INTERCONNECT DESIGN Plac
Page 25 and 26: BOTTOM TERMINATE COMPONENT SENSITIV
Page 27 and 28: COMPONENT ISSUES - WARPAGE & THERMA
Page 29: COMPONENT PAD - THERMAL IMBALANCE S
Page 33 and 34: TIN-LEAD VS LEAD FREE WICKING Depen
Page 35 and 36: TEST POINT AND SUPPORT DISTRIBUTION
Page 37 and 38: EXAMPLE OF EXCESSIVE STRESS BGA Con
Page 39: QUESTIONS 39

Lead Free Soldering - SMTA

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