Lead Free Soldering - SMTA
Lead Free Soldering - SMTA
Lead Free Soldering - SMTA
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MECHANICAL STRESS/STRAIN IMPACTS<br />
Mechanical stress/strain impact analysis to identify test-initiated potential latent<br />
field failure modes<br />
• Solder joint crack initiation or fracture<br />
• Micro/buried via design impacts<br />
– Surface copper cracking/separation<br />
– Internal copper cracking/separation<br />
• Mechanical strain concentration<br />
– Test point concentration<br />
– Final assembly/disassembly<br />
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