Lead Free Soldering - SMTA

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MECHANICAL STRESS/STRAIN IMPACTS Mechanical stress/strain impact analysis to identify test-initiated potential latent field failure modes • Solder joint crack initiation or fracture • Micro/buried via design impacts – Surface copper cracking/separation – Internal copper cracking/separation • Mechanical strain concentration – Test point concentration – Final assembly/disassembly 36
EXAMPLE OF EXCESSIVE STRESS BGA Connection Near J5 • Bottom 3 Solder Connections • Two (2) Rows Of Solder Balls K L M 1 2 37
Page 1 and 2: DFX FOR LEAD FREE PROCESSING AND RE
Page 3 and 4: TECHNOLOGY DRIVEN DESIGNS Component
Page 5 and 6: MEET FUNCTIONAL AND LEGISLATIVE REQ
Page 7 and 8: MICRO-VIA DESIGN - RELIABILITY IMPA
Page 9 and 10: LEAD TO HOLE CLEARANCE Lead Angle I
Page 11 and 12: INTERNAL PCB IMPACTS Number of laye
Page 13 and 14: THROUGH HOLE PAD DESIGN Square Pads
Page 15 and 16: SOLDER MASK SELECTION IMPACT A Low
Page 17 and 18: THROUGH-HOLE COMPONENT MOUNTING Lea
Page 19 and 20: Are You Confused About Design For M
Page 21 and 22: SOLDER MASK DESIGN AND FABRICATOR I
Page 23 and 24: IMPACTS OF INTERCONNECT DESIGN Plac
Page 25 and 26: BOTTOM TERMINATE COMPONENT SENSITIV
Page 27 and 28: COMPONENT ISSUES - WARPAGE & THERMA
Page 29 and 30: COMPONENT PAD - THERMAL IMBALANCE S
Page 31 and 32: STENCIL TO PCB ALIGNMENT Smaller co
Page 33 and 34: TIN-LEAD VS LEAD FREE WICKING Depen
Page 35: TEST POINT AND SUPPORT DISTRIBUTION
Page 39: QUESTIONS 39

Lead Free Soldering - SMTA

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