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Heterostructure Band Engineering of Type-II InAs/GaSb Superlattice ...

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Spectral Response (a.u.)<br />

1.4<br />

1.2<br />

1.0<br />

0.8<br />

0.6<br />

0.4<br />

0.2<br />

λc=10.8 μm<br />

PbIbN<br />

PIN<br />

λc=11.0 μm<br />

0.0<br />

8.5 9.0 9.5 10.0 10.5 11.0 11.5 12.0 12.5<br />

Wavelength (μm)<br />

Figure 3. Spectral response <strong>of</strong> PIN and PbIbN devices at 77K with cut<strong>of</strong>f wavelength <strong>of</strong> 11.0 µm and 10.8 µm<br />

respectively.<br />

Current-voltage (IV) characteristics were measured for all the devices from 30K to 250K using HP4145 semiconductor<br />

parameter analyzer. Figure 4(a) shows temperature dependent dark current characteristics for PbIbN detector and figure<br />

4(b) compares it with PIN detector at 77K. At lower temperatures, these devices show asymmetric diode characteristic<br />

while at higher temperatures the I-V curves become symmetric owing to the dark current due to thermal generation <strong>of</strong><br />

carriers.<br />

J (A/cm 2 )<br />

100<br />

10<br />

1<br />

0.1<br />

0.01<br />

1E-3<br />

1E-4<br />

1E-5<br />

-3 -2 -1 0 1 2 3<br />

Bias (V)<br />

(a)<br />

77K<br />

150K<br />

200K<br />

250K<br />

J (A/cm 2 )<br />

100<br />

10<br />

1<br />

0.1<br />

0.01<br />

1E-3<br />

1E-4<br />

1E-5<br />

1E-6<br />

77K<br />

-1.5 -1.0 -0.5 0.0 0.5 1.0 1.5<br />

Bias (V)<br />

(b)<br />

PIN<br />

PbIbN<br />

Figure 4. (a) Variable temperature dark current characteristics <strong>of</strong> PbIbN detector, (b) dark current density comparison<br />

<strong>of</strong> PbIbN design with PIN design at 77K.<br />

As shown in figure 4(b), PbIbN design shows significantly improved performance over PIN detector. The major sources<br />

<strong>of</strong> dark current in a PIN detector are thermal generation <strong>of</strong> carriers, SRH current, tunneling currents and minority carrier<br />

diffusion current. In PbIbN design, an electron barrier <strong>of</strong> wider bandgap material is placed between P contact layer and<br />

absorber region I. When the detector is operated under reverse bias, photogenerated holes move towards P contact while<br />

electrons move towards N contact. The eB layer allows unimpeded flow <strong>of</strong> holes while blocking electrons and also leads<br />

Proc. <strong>of</strong> SPIE Vol. 7660 76601T-4<br />

Downloaded from SPIE Digital Library on 21 May 2010 to 64.106.37.191. Terms <strong>of</strong> Use: http://spiedl.org/terms

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