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Signetics Programmable Logic Devices - Al Kossow's Bitsavers

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<strong>Signetics</strong> <strong>Programmable</strong> <strong>Logic</strong> <strong>Devices</strong><br />

Quality and Reliability<br />

,.<br />

WAFER<br />

FABRlCA110N<br />

I<br />

0<br />

I<br />

0<br />

I<br />

DIE ATTACH<br />

WIRE BOND<br />

I<br />

~<br />

I<br />

rl HERMElIC<br />

IlEAL<br />

I<br />

I<br />

EHCAPSULATION<br />

PlAS1IC ~<br />

0 ----- ..... ~ --------<br />

I<br />

0 --------<br />

b<br />

--------<br />

0 --- .. --_ ...<br />

I<br />

0 ----- .. --<br />

I<br />

0 - .. -_ .. _--<br />

I<br />

0 .............. -<br />

I<br />

0 .. _----_ ..<br />

I<br />

0 .............. -<br />

SCANNNG ELECTRON IICIIOSCOPE CONTROL<br />

__ are 88II'1>iod dally by tho Quality ConIroI LaborIOory from __ 1caI1on ""'" and subjaded 10 SEM<br />

analyola. Thll _ control "",oaII manufacturing deI_ lWCh as _ and oxide BfAIp CXJY8IIIII8ln tho<br />

motaI~atlon _ wtllch may ,..uIIln oarty fallu ....<br />

DIE SORT WlUAL ACCEPTANCE<br />

Product Ito InapecOad for deledl CIWI8d during fab_. wafer _Ing. or tho _lc:aIocrbo end brook<br />

"""ration. DoIoc:I8 .uch .. ocratchoo ......... and glasolvatod bondilg pods .... Included In tho lot aoooptanco<br />

allorla.<br />

PRE-SEAL VISUAL ACCEPTANCE<br />

Product Ie Inspeeled 10 detect orry damage Incurred at the die attach and wlro bonding stations. 001_ ouch ..<br />

ocratch ... contamination and ,",,",ad ball bondo are Included In tho lot aoooptanco critorto.<br />

STABlUZA1lOII BAKE PRECONDITIONNG<br />

_Ic molded devices arobak8dlOltn188 wlreand die banda and hoIpollmlnato marglnal_ .• atoo ensures<br />

on optimum plastic seal 10 onh0nc8 moIItu ....._ Hermetle _ are bak8d 10 onou18 tho elimination<br />

01 any remalnlng cavity moIIture.<br />

TEMPERATURE CYCUNG (_)<br />

Uolng ML-S1O-i83Mothod tOtO.l Cond_CdeYlces ... cyctodfnxncoldlOhot...",....u ... I"""'Ing.<br />

ve

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