Low Temperature Mechanical Properties Of Copper and Selected ...

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$Standard X-ray Diffraction Powder Patterns$

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Fatigue Behavior of <strong>Copper</strong> CURVE NO. Cu COMPOSITION ( weight*} Zn Sn Ai Ni Other REF NO. 80 x 10 T lOb Annealed I202'F - ] hr. - 0.015 to 0.020mm. C. S. , room »«. 64 temp. : U. T.S. -- 39.800 p.i - Y S 12.800 p., (0.2% off.et)- 0. 60 0. 74Cd, 0. OlMn. 0. OlSi 10 78a reduced diam. , rotating beam - 2700 c . p. m ., R- -1, gallon: '1^ a. i cycle' dld not br
Fatigue Behavior of <strong>Copper</strong> CURVE NO. Cu Zn Sn COMPOSITION ght%| At Ni Other REF. NO. lOa Drawn 67% - 0.040mm. G. S. , room temp. : U. T. S. - 7b,700 psi - Y. S. = 73,800 psi (0.2% offset) - Rg = 73, bar supplied- 98. 67 0. 52 0. 81Cd polished, rotating beam - 3500 r.p.m. , sample at 30,000 psi- 6 X 10 8 cycles did not break. 1 la Drawn 36% -0.040mm. G. S. , room temp. : U.T.S. - 48.800 psi - Y. S. = 46,500 psi (0.2% offset) - R B = 47, electrolytic 99. 95 0. 03O 11 lib beam - 3500 r.p.m. Drawn 39% -0.125mm. G. S. , room temp, : U. T. S. = 51,000 psi - Y.S. = 49,000 psi (0.2% offset) - R B = 37, oxygen-free 99. 95 0. 03O " rotating beam - 3500 r.p.m. 58 a 58 sample - tapered part - 3-9/32 inches long X 3/16 inch 58 b Reduced 37% - 0.033mm. G. S. , room temp, : U. T. S. = 99. 93 58 58 41, 400 psi - R = 40, phosphorized. Bar sample - 0. 3 0.01P 58 58e 0.01P 58 58f 99. 97 0.01P 53 Wg specifications sa-ne as 58a. 0. 03P 58 I06 I07 I0e FATIGUE LIFE, cycles to9 5Bh Reduced 37% - 0.025mm. G. S. , room temp. : U. T. S. - 51,600 99. 96 0.03P 58 as 58a. 58 1 Reduced 60% - 0.030mm. G. S. , room temp. : U. T. S. -- 59,300 99. 96 0.03P 58 as 58a. CURVE NO. MATERIAL AND TEST PARAMETERS Cu COMPOSITION (weight%) Zn Sn A( Ni Other REF. NO. 78c Cold rolled -,o hard temper, plate supplied. Bar sample - diam. , rotating beam - 2700 c. p.m. , sample at 2 1, 200 93. 60 0. 78 0. 45Si. O.OSFe, 0.05P, 0.02As 78 70 -————— - Ilia. 0. 02Fe 211 ± 8%. 211b Cold rolled, room temp.: U.T.S. = 40,430 psi, electro- O.OIFe 211 c.p.m. , data spread ± 12%. 211c Hot rolled, room temp. : U. T. S. =3], 433 psi. Data 0. OIFe 211 356e 99. 92 0. 043 356 inch diam. Bar sample - 0. 5 inch reduced diam. , 2200 did not break. 356f Tested in vacuum - 0. 0005 to 0.001mm. Hg. Other 99. 92 0. 04O 356 356g Exuded to 7 8% reduction of area, room temp. : U. T. S. = 99. 96 356 356h specifications game as 356g. 9'9. 96 356 32,900 p«i, phosphorized, bar supplied - 3/4 inch diam. 99. 96 0. 02P 356 in air. 356j Tested in vacuum - 0. 0005 to 0.031mm. Hg., sample at 99.96 0.02P 356 specifications same as 356i. 436* Cold rolled, room temp. : U. T. S. = 52,000 psi, Y. S. = 21,500 O.OIFe 436 41
Page 1 and 2: CI3.44:Jdl Low Temperature Mechanic
Page 3: UNITED STATES DEPARTMENT OF COMMERC
Page 7 and 8: Low-Temperature Mechanical Properti
Page 9 and 10: Section I In this section average v
Page 11 and 12: Mechanical Properties of Copper TEM
Page 13 and 14: Mechanical Properties of Cu-Zn (Bra
Page 15 and 16: Mechanical Properties of Cu-Sn (Pho
Page 17 and 18: Mechanical Properties of Cu-Si (Sil
Page 19 and 20: Mechanical Properties of Cu-Ni rlli
Page 21: j Mechanical Properties of Cu-Al-Fe
Page 24 and 25: Contents Copper Tensile and yield s
Page 26 and 27: Tensile and Yield Strength of Coppe
Page 34 and 35: Tensile Elongation of Copper TEMPER
Page 36 and 37: Tensile Elongation of Copper TEMPER
Page 38 and 39: Tensile Elongation of Copper (Oxyge
Page 40 and 41: ! i ! s?l • ,j o. I 3 p - 0 5' o
Page 42 and 43: Tensile Reduction of Area of Copper
Page 44 and 45: Tensile Stress-Strain Curves of Cop
Page 46 and 47: Hardness of Copper TEMPERATURE, *F
Page 50 and 51: Fatigue Behavior of Copper (Electro
Page 52 and 53: Creep Behavior of Copper Cf KV*. CO
Page 54 and 55: \ Creep Behavior of Copper COMPOSIT
Page 56 and 57: Creep Behavior of Copper (Oxygen-Fr
Page 58 and 59: Stress-Rupture Behavior of Copper C
Page 60 and 61: Modulus of Elasticity of Copper TEM
Page 62 and 63: Tensile and Yield Strength of 95Cu-
Page 64 and 65: Fatigue Behavior of 95Cu-5Zn (Glidi
Page 66 and 67: Tensile and Yield Strength of 90Cu-
Page 68 and 69: Impact Energy of 90Cu-10Zn (Commerc
Page 70 and 71: . Modulus of Rigidity of 90Cu-10Zn
Page 72 and 73: Tensile Stress-Strain Curves of 85C
Page 74 and 75: ! 1 Creep Behavior of 85Cu-15Zn (Re
Page 76 and 77: 1 Tensile and Yield Strength of 80C
Page 78 and 79: Fatigue Behavior of 80Cu-20Zn (Low
Page 80 and 81: Tensile Reduction of Area of 71Cu-2
Page 82 and 83: Modulus of Elasticity of 71Cu-28Zn-
Page 84 and 85: j j j Tensile Elongation of 70Cu-30
Page 86 and 87: Fatigue Behavior of 70Cu-30Zn (Cart
Page 88 and 89: \ 1 Fatigue Behavior of 70Cu-30Zn (
Page 90 and 91: Tensile Elongation of 65Cu-35Zn (Ye
Page 92 and 93: Modulus of Elasticity of 65Cu-35Zn
Page 94 and 95: Tensile Elongation of 60Cu-39Zn-lSn
Page 96 and 97: | i Impact Energy of 60Cu-39Zn-lSn
Page 98 and 99:
Modulus of Elasticity of 60Cu-39Zn-
Page 100 and 101:
Tensile Reduction of Area of 60Cu-4
Page 102 and 103:
Fatigue Behavior of 60Cu-40Zn (Munt
Page 104 and 105:
Tensile and Yield Strength of 90Cu-
Page 106 and 107:
Impact Energy of 90Cu-10Ni TEMPERAT
Page 108 and 109:
Page 110 and 111:
t il u 0 1 2 N. O ISf 5-2E "is !" n
Page 112 and 113:
Page 114 and 115:
| Impact Energy of 70Cu-30Ni CURVE
Page 116 and 117:
Modulus of Elasticity of 70Cu-30Ni
Page 118 and 119:
Impact Energy of 55Cu-45Ni TEMPERAT
Page 120 and 121:
Tensile Reduction of Area of Cu-Ni-
Page 122 and 123:
Tensile and Yield Strength of Cu-Si
Page 124 and 125:
Impact Energy of Cu-Si (Silicon Bro
Page 126 and 127:
Fatigue Behavior of Cu-Si (Silicon
Page 128 and 129:
Tensile and Yield Strength of Cu-Sn
Page 130 and 131:
Tensile Reduction of Area of Cu-Sn
Page 132 and 133:
Fatigue Behavior of Cu-Sn (Phosphor
Page 134 and 135:
Creep Behavior of Cu-Sn (Phosphor B
Page 136 and 137:
Tensile and Yield Strength of Cu-Al
Page 138 and 139:
Tensile Elongation of Cu-Al (Alumin
Page 140 and 141:
Tensile Stress-Strain Curves of Cu-
Page 142 and 143:
\ i Fatigue Behavior of Cu-Al (Alum
Page 144 and 145:
Tensile and Yield Strength of Cu-Al
Page 146 and 147:
Tensile Stress-Strain Curves of Cu-
Page 148 and 149:
Creep Behavior of Cu-Al-Ni (Nickel
Page 151 and 152:
1. Reference Guide for Review Paper
Page 153 and 154:
i 3. Reference Guide for Experiment
Page 155 and 156:
5. Reference Guide for Experimental
Page 157:
7. Reference Guide for Experimental
Page 161 and 162:
List of References 1. NBS Institute
Page 163 and 164:
120. Gillett, H. W., Impact resista
Page 165 and 166:
219. McEvily, A. J., Boettner, R. C
Page 167 and 168:
333. Wellinger, K., Seufert W., Unt
Page 169:
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