Download Annual Report 2006 - Mühlbauer Group

TECHNICAL GLOSSARY85Power Devices: Semiconductor products such as highvoltagetransistors or diodesPre-Personalization: Loading an operating system ontoa chipRemote maintenance tool: Via the remote maintenancetool, the service technician can carry out remote maintenancetasks on the computer (system) of the customerRFID Chips: Radio Frequency Identification; componentsused in a high frequency rangeSD (Secure Digital) Card: Secure memory card similar toMMC multimedia cards; card application particularly usedfor digital cameras or as a storage medium for music, PDA,etc.Smart Card: Chip card, i.e. plastic card equipped with achip moduleSmart Label: Ultra-flat transponders consisting of chip,antenna and substrate for identifying goods and personsSmart Media and Multi Media Cards: Card applicationused in particular for digital cameras or as storage mediumfor music, etc.SMD (Surface Mounted Device): Components, whichare directly soldered to a board without drill holes. SMDcomponents significantly reduce the component density ofelectronic circuitsTag: RFID transponders are also termed as 'Tags'TECURITY ® : Terms a market for technologically sophisticatedand security-relevant solutions, taken from the twowords Technology and SecurityTesting & Packaging: Testing, labeling and packagingsemiconductor components for further processingTraceability: Pursuing and tracing back units from the rawmaterial to the end productTransponder: Antenna located on a Smart Label betweenflexible carrier layersTurn-Key Solutions: Turn-key product and services solutionsUpstream tracing: Tracability from consumer to dealer, hissuppliers and if required also to original manufacturerVerification: Verification, if the user of an ID card really isthe legal holderVision Technology: Measuring and controlling componentsusing camera systems and softwareWafer: Ultra-thin and silicon semiconductor disk for producingmany individual chips. The dice are sawn from thesurface of the waferWafer Level Package: Finished components on a waferbasis,which are subject to further processingWire Bonding: Fully automated process for wiring dicewith carrier materialTAL (Tag Assembly Line): Mühlbauer production systemfor the manufacture of Smart Inlays (Smart Inlay = antennaand functional chip)