ME 141B: The MEMS Class Introduction to MEMS and MEMS Design

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Projection Lithography• Projection lithography, especiallywhen combined with an opticalimaging system that reduces theimage size, is used for high-resolutionpatterning (submicron to verysubmicron)• Larger mask features, no contact withmask• Wafer steppers expose one die at atime, assuring good focus andregistration• Something to consider: if your deviceneeds a fine features, a stepper maybe required. But steppers have limitson dies size of about 1 cm.9/21/10 42/45
Mask Making• Highest quality – chromium on fusedquartz written with an electron beamexposing an electron-beam resist (PMMA) Also very high quality: laser-writing• Photographic emulsion on fused quartzexposed with UV light flashes through aprogrammable aperture• Patterns printed from an L-EDIT file ontransparencies with a very high-resolutionprinter – low resolution, but cheap and fast9/21/10 43/45
Page 1 and 2: ME 141B: The MEMS ClassIntroduction
Page 3 and 4: Handouts• Syllabus/Schedule Hando
Page 5 and 6: Course Overview• First week - Ove
Page 7 and 8: Outline• Class odds and ends• I
Page 9 and 10: What are MEMS?• Microfabrication
Page 11 and 12: What are MEMS?• Now, many “MEMS
Page 14 and 15: MEMS : History• MEMS blossomed in
Page 16 and 17: MEMS: Current Topics• Optical MEM
Page 18 and 19: MEMS: BioMEMS• Shows promise for
Page 20 and 21: MEMS: Commercial• The major succe
Page 22 and 23: MEMS Design• For our purposes, de
Page 24 and 25: Some solutions to this challenge•
Page 28 and 29: Course Outline• First up: fabrica
Page 32 and 33: • Silicon is adiamondstructurecub
Page 34 and 35: Silicon: Diamond Structure• The d
Page 36 and 37: SOI• Silicon wafers with embedded
Page 38 and 39: Substrate Summary9/21/10 38/45
Page 40 and 41: Optical Lithography9/21/10 40/45
Page 44 and 45: Positive thin resist• Spin cast
Page 46 and 47: Positive Thick Photoresist• Spin
Page 48 and 49: Special purpose lithographictechniq
Page 50 and 51: Very Thick Photoresists• SU-8 epo
Page 52 and 53: Cleaning!• When we say (for examp
Page 54 and 55: Another important detail: process b

ME 141B: The MEMS Class Introduction to MEMS and MEMS Design

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