ME 141B: The MEMS Class Introduction to MEMS and MEMS Design
ME 141B: The MEMS Class Introduction to MEMS and MEMS Design
ME 141B: The MEMS Class Introduction to MEMS and MEMS Design
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Double-sided aligned lithography• Goal: align features on the back of thewafer <strong>to</strong> features on the front Common requirement in bulk micromachining Not a st<strong>and</strong>ard IC capability Functionality more common as market grows• What you need: Double side polished wafer Double sided alignment <strong>to</strong>ol• IR alignment, registration <strong>to</strong> global fiducials in the<strong>to</strong>ol, through holes, etc.9/21/10 47/45
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