MCP3001 2.7V 10-Bit A/D Converter with SPI Serial ... - Microchip

MCP3001Load circuit for t R , t F , t DO1.4V3kΩ Test PointD OUTC L = 30 pFD OUTLoad circuit for t DIS and t ENTest Pointt DIS Waveform 23kΩ30 pFV DDV DD/2t EN Waveformt DIS Waveform 1CSCLKV SS3 4Voltage Waveforms for t R , t FVoltage Waveforms for t END OUTt RV OHV OLt F1 2D OUTB9t ENVoltage Waveforms for t DOVoltage Waveforms for t DISCLKt DOCSD OUTWaveform 1*V IH90%t DISD OUTD OUTWaveform 2†10%* Waveform 1 is for an output with internal conditionssuch that the output is high, unless disabledby the output control.† Waveform 2 is for an output with internal conditionssuch that the output is low, unless disabledby the output control.FIGURE 1-2:Test Circuits.© 2007 Microchip Technology Inc. DS21293C-page 5

MCP3001Note: Unless otherwise indicated, V DD = V REF = 5V, f SAMPLE = 200 ksps, f CLK = 14*Sample Rate,T A = 25°CIDD (µA)500450400350300250200150V REF = V DD100All points at f CLK = 2.8 MHz except50 at V REF = V DD = 2.5V, f CLK =1.05 MHz02.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0V DD (V)IREF (µA)12011010090807060504030 V REF = V DD20 All points at f CLK = 2.8 MHz except10 at V REF = V DD = 2.5V, f CLK = 1.05 MHz02.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0V DD (V)FIGURE 2-31: I DD vs. V DD .FIGURE 2-34: I REF vs. V DD .IDD (µA)500450400350300 VDD = VREF = 5V250200150VDD = VREF = 2.7V10050010 100 1000 10000IREF (µA)12011010090V DD = V REF = 5V8070605040V DD = V REF = 2.7V302010010 100 1000 10000Clock Frequency (kHz)Clock Frequency (kHz)FIGURE 2-32: I DD vs. Clock Frequency.FIGURE 2-35: I REF vs. Clock Frequency.IDD (µA)600550500450400350V DD = V REF = 5Vf CLK = 2.8 MHz300250200150V DD = V REF = 2.7V10050f CLK = 1.05 MHz0-50 -25 0 25 50 75 100Temperature (°C)IREF (µA)1201101009080706050403020V DD = V REF = 2.7Vf CLK = 1.05 MHzV DD = V REF = 5Vf CLK = 2.8 MHz100-50 -25 0 25 50 75 100Temperature (°C)FIGURE 2-33: I DD vs. Temperature.FIGURE 2-36: I REF vs. Temperature.© 2007 Microchip Technology Inc. DS21293C-page 11

MCP3001Note: Unless otherwise indicated, V DD = V REF = 5V, f SAMPLE = 200 ksps, f CLK = 14*Sample Rate,T A = 25°CIDDS (pA)60VREF = CS = VDD504030201002.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0V DD (V)Analog Input Leakage (nA)2.01.8 V DD = V REF = 5V1.61.41.21.00.80.60.40.20.0-50 -25 0 25 50 75 100Temperature (°C)FIGURE 2-37: I DDS vs. V DD .FIGURE 2-39: Analog Input Leakage Current vs.Temperature.100.00V DD = V REF = CS = 5V10.00IDDS (nA)1.000.100.01-50 -25 0 25 50 75 100Temperature (°C)FIGURE 2-38: I DDS vs. Temperature.DS21293C-page 12© 2007 Microchip Technology Inc.

MCP30013.0 PIN DESCRIPTIONS3.1 IN+Positive analog input. This input can vary from IN- toV REF + IN-.3.2 IN-Negative analog input. This input can vary ±100 mVfrom V SS .3.3 CS/SHDN(Chip Select/Shutdown)The CS/SHDN pin is used to initiate communicationwith the device when pulled low and will end a conversionand put the device in low power standby whenpulled high. The CS/SHDN pin must be pulled highbetween conversions.3.4 CLK (Serial Clock)The SPI clock pin is used to initiate a conversion and toclock out each bit of the conversion as it takes place.See Section 6.2 for constraints on clock speed.3.5 DOUT (Serial Data output)The SPI serial data output pin is used to shift out theresults of the A/D conversion. Data will always changeon the falling edge of each clock as the conversiontakes place.4.0 DEVICE OPERATIONThe MCP3001 A/D converter employs a conventionalSAR architecture. With this architecture, a sample isacquired on an internal sample/hold capacitor for1.5 clock cycles starting on the first rising edge of theserial clock after CS has been pulled low. Following thissample time, the input switch of the converter opensand the device uses the collected charge on the internalsample and hold capacitor to produce a serial 10-bitdigital output code. Conversion rates of 200 ksps arepossible on the MCP3001. See Section 6.2 for informationon minimum clock rates. Communication with thedevice is done using a 3-wire SPI-compatible interface.In this diagram, it is shown that the source impedance(R S ) adds to the internal sampling switch, (R SS ) impedance,directly affecting the time that is required tocharge the capacitor, C SAMPLE . Consequently, a largersource impedance increases the offset, gain, and integrallinearity errors of the conversion.Ideally, the impedance of the signal source should benear zero. This is achievable with an operational amplifiersuch as the MCP601, which has a closed loop outputimpedance of tens of ohms. The adverse affects ofhigher source impedances are shown in Figure 4-2.If the voltage level of IN+ is equal to or less than IN-, theresultant code will be 000h. If the voltage at IN+ is equalto or greater than {[V REF + (IN-)] - 1 LSB}, then the outputcode will be 3FFh. If the voltage level at IN- is morethan 1 LSB below V SS , then the voltage level at the IN+input will have to go below V SS to see the 000h outputcode. Conversely, if IN- is more than 1 LSB above Vss,then the 3FFh code will not be seen unless the IN+input level goes above V REF level.4.2 Reference InputThe reference input (V REF ) determines the analog inputvoltage range and the LSB size, as shown below.LSB Size =V REF------------1024As the reference input is reduced, the LSB size isreduced accordingly. The theoretical digital output codeproduced by the A/D Converter is a function of the analoginput signal and the reference input as shownbelow.1024*V INDigital Output Code = -----------------------V REF4.1 Analog InputsThe MCP3001 provides a single pseudo-differentialinput. The IN+ input can range from IN- to (V REF +IN-).The IN- input is limited to ±100 mV from the V SS rail.The IN- input can be used to cancel small signal common-modenoise which is present on both the IN+ andIN- inputs.For the A/D Converter to meet specification, the chargeholding capacitor, C SAMPLE must be given enough timeto acquire a 10-bit accurate voltage level during the1.5 clock cycle sampling period. The analog inputmodel is shown in Figure 4-1.where:V IN = analog input voltage = V(IN+) - V(IN-)V REF = reference voltageWhen using an external voltage reference device, thesystem designer should always refer to the manufacturer’srecommendations for circuit layout. Any instabilityin the operation of the reference device will have adirect effect on the operation of the ADC.© 2007 Microchip Technology Inc. DS21293C-page 13

MCP3001R SSCHxV DDV T = 0.6VSamplingSwitchSS R S = 1 kΩVAC PIN7pFV T = 0.6VI LEAKAGE±1 nAC SAMPLE= DAC capacitance= 20 pFV SSLegendVA = signal sourceR SS = source impedanceCHx = input channel padC PIN= input pin capacitanceV T= threshold voltageI LEAKAGE = leakage current at the pindue to various junctionsSS = sampling switchR S= sampling switch resistorC SAMPLE= sample/hold capacitanceFIGURE 4-1:Analog Input Model.Clock Frequency (MHz)4.03.5V DD = V REF = 5V3.0f SAMPLE = 200 ksps2.52.0V DD = V REF = 2.7V1.5f SAMPLE = 75 ksps1.00.50.0100 1000 10000Input Resistance (Ohms)FIGURE 4-2: Maximum Clock Frequency vs. InputResistance (R S ) to maintain less than a 0.1LSBdeviation in INL from nominal conditions.DS21293C-page 14© 2007 Microchip Technology Inc.

MCP30015.0 SERIAL COMMUNICATIONSCommunication with the device is done using a standardSPI compatible serial interface. Initiating communicationwith the MCP3001 begins with the CS goinglow. If the device was powered up with the CS pin low,it must be brought high and back low to initiate communication.The device will begin to sample the analoginput on the first rising edge after CS goes low. Thesample period will end in the falling edge of the secondclock, at which time the device will output a low null bit.The next 10 clocks will output the result of the conversionwith MSB first, as shown in Figure 5-1. Data isalways output from the device on the falling edge of theclock. If all 10 data bits have been transmitted and thedevice continues to receive clocks while the CS is heldlow, the device will output the conversion result LSBfirst, as shown in Figure 5-2. If more clocks are providedto the device while CS is still low (after the LSBfirst data has been transmitted), the device will clockout zeros indefinitely.If it is desired, the CS can be raised to end the conversionperiod at any time during the transmission. Fasterconversion rates can be obtained by using this techniqueif not all the bits are captured before starting anew cycle. Some system designers use this method bycapturing only the highest order 8 bits and ‘throwingaway’ the lower 2 bits.t CYCCSt SUCSPowerDownD OUTHI-Z NULLHI-Z NULLBIT B9 B8 B7 B6 B5 B4 B3 B2 B1 B0*BIT B9 B8 B7 B6CLKt SAMPLEt CONVt DATA**t CSH* After completing the data transfer, if further clocks are applied with CS low, the ADC will output LSB first data,followed by zeros indefinitely. See Figure below.** t DATA : during this time, the bias current and the comparator powers down and the reference input becomes ahigh impedance node.FIGURE 5-1:Communication with MCP3001 (MSB first Format).CSt CSHt SUCSt CYCPower DownCLKt SAMPLE tCONV t DATA**D HI-Z NULLOUT BIT B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 B1 B2 B3 B4 B5 B6 B7 B8 B9HI-Z* After completing the data transfer, if further clocks are applied with CS low, the ADC will output zeros indefinitely.** t DATA: during this time, the bias current and the comparator powers down and the reference input becomes ahigh impedance node leaving the CLK running to clock out the LSB-first data or zeros.FIGURE 5-2:Communication with MCP3001 (LSB first Format).© 2007 Microchip Technology Inc. DS21293C-page 15

MCP30016.0 APPLICATIONS INFORMATION6.1 Using the MCP3001 withMicrocontroller SPI PortsWith most microcontroller SPI ports, it is required toclock out eight bits at a time. If this is the case, it will benecessary to provide more clocks than are required forthe MCP3001. As an example, Figure 6-1 andFigure 6-2 show how the MCP3001 can be interfacedto a microcontroller with a standard SPI port. Since theMCP3001 always clocks data out on the falling edge ofclock, the MCU SPI port must be configured to matchthis operation. SPI Mode 0,0 (clock idles low) and SPIMode 1,1 (clock idles high) are both compatible withthe MCP3001. Figure 6-1 depicts the operation shownin SPI Mode 0,0, which requires that the CLK from themicrocontroller idles in the ‘low’ state. As shown in thediagram, the MSB is clocked out of the ADC on the fallingedge of the third clock pulse. After the first eightclocks have been sent to the device, the microcontroller’sreceive buffer will contain two unknown bits (theoutput is at high impedance for the first two clocks), thenull bit and the highest order five bits of the conversion.After the second eight clocks have been sent to thedevice, the MCU receive register will contain the lowestorder five bits and the B1-B4 bits repeated as the ADChas begun to shift out LSB first data with the extraclocks. Typical procedure would then call for the lowerorder byte of data to be shifted right by three bits toremove the extra B1-B4 bits. The B9-B5 bits are thenrotated 3 bits to the right with B7-B5 rotating from thehigh order byte to the lower order byte. Easier manipulationof the converted data can be obtained by usingthis method.Figure 6-2 shows SPI Mode 1,1 communication whichrequires that the clock idles in the high state. As withmode 0,0, the ADC outputs data on the falling edge ofthe clock and the MCU latches data from the ADC in onthe rising edge of the clock.CSMCU latches data from ADCon rising edges of SCLKCLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16Data is clocked out ofADC on falling edgesD OUTHI-ZNULLBITB9 B8 B7 B6 B5 B4 B3 B2 B1 B0 B1 B2B3 B4HI-ZLSB first data beginsto come out? ? 0B9 B8 B7 B6B5 B4 B3 B2 B1 B0 B1 B2B3Data stored into MCU receive registerafter transmission of first 8 bitsData stored into MCU receive registerafter transmission of second 8 bitsFIGURE 6-1:SPI Communication with the MCP3001 using 8-bit segments (Mode 0,0: SCLK idles low).CSMCU latches data from ADCon rising edges of SCLKCLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16Data is clocked out ofADC on falling edgesD OUTHI-ZNULLBITB9 B8 B7 B6 B5 B4 B3 B2 B1 B0 B1 B2B3HI-ZLSB first data beginsto come out? ? 0B9 B8 B7 B6B5 B4 B3 B2 B1 B0 B1 B2B3Data stored into MCU receive registerafter transmission of first 8 bitsData stored into MCU receive registerafter transmission of second 8 bitsFIGURE 6-2:SPI Communication with the MCP3001 using 8-bit segments (Mode 1,1: SCLK idles high).DS21293C-page 16© 2007 Microchip Technology Inc.

MCP30016.2 Maintaining Minimum Clock SpeedWhen the MCP3001 initiates the sample period, chargeis stored on the sample capacitor. When the sampleperiod is complete, the device converts one bit for eachclock that is received. It is important for the user to notethat a slow clock rate will allow charge to bleed off thesample cap while the conversion is taking place. At85°C (worst case condition), the part will maintainproper charge on the sample cap for 700 µs atV DD = 2.7V and 1.5 ms at V DD = 5V. This means that atV DD = 2.7V, the time it takes to transmit the first 14clocks must not exceed 700 µs. Failure to meet this criterionmay induce linearity errors into the conversionoutside the rated specifications.6.3 Buffering/Filtering the Analog InputsIf the signal source for the ADC is not a low impedancesource, it will have to be buffered or inaccurate conversionresults may occur. See Figure 4-2. It is also recommendedthat a filter be used to eliminate any signalsthat may be aliased back into the conversion results.This is illustrated in Figure 6-3 where an op amp isused to drive, filter and gain the analog input of theMCP3001. This amplifier provides a low impedancesource for the converter input and a low pass filter,which eliminates unwanted high frequency noise.Low pass (anti-aliasing) filters can be designed usingMicrochip’s interactive FilterLab software. FilterLabwill calculate capacitor and resistor values, as well asdetermine the number of poles that are required for theapplication. For more information on filtering signals,see the application note AN699 “Anti-Aliasing AnalogFilters for Data Acquisition Systems.”6.4 Layout ConsiderationsWhen laying out a printed circuit board for use withanalog components, care should be taken to reducenoise wherever possible. A bypass capacitor shouldalways be used with this device and should be placedas close as possible to the device pin. A bypass capacitorvalue of 1 µF is recommended.Digital and analog traces should be separated as muchas possible on the board and no traces should rununderneath the device or the bypass capacitor. Extraprecautions should be taken to keep traces with highfrequency signals (such as clock lines) as far as possiblefrom analog traces.Use of an analog ground plane is recommended inorder to keep the ground potential the same for alldevices on the board. Providing V DD connections todevices in a “star” configuration can also reduce noiseby eliminating current return paths and associatederrors. See Figure 6-4. For more information on layouttips when using ADC, refer to AN-688 “Layout Tips for12-Bit A/D Converter Applications”.Device 1V DDConnectionDevice 44.096VReferenceV DD10 µFDevice 2Device 30.1 µFMCP154110 µFR 1V INC 1R 2C 2MCP601IN-+-V REFIN+MCP3001R 4R 3C L1µFFIGURE 6-4: V DD traces arranged in a ‘Star’configuration in order to reduce errors caused bycurrent return paths.FIGURE 6-3: The MCP601 operational amplifier isused to implement a 2nd order anti-aliasing filter forthe signal being converted by the MCP3001.© 2007 Microchip Technology Inc. DS21293C-page 17

MCP30017.0 PACKAGING INFORMATION7.1 Package Marking Information8-Lead PDIP (300 mil)XXXXXXXXXXXXXNNNYYWWExample:MCP3001I/PNNN e307368-Lead SOIC (150 mil)Example:XXXXXXXXXXXXYYWWNNNMCP3001ISN e3 0736NNN8-Lead MSOPXXXXXXYWWNNNExample:3001I725NNNe38-Lead TSSOPXXXXYYWWNNNExample:30010716NNNe3Legend: XX...X Customer-specific informationY Year code (last digit of calendar year)YY Year code (last 2 digits of calendar year)WW Week code (week of January 1 is week ‘01’)NNNe3Alphanumeric traceability codePb-free JEDEC designator for Matte Tin (Sn)* This package is Pb-free. The Pb-free JEDEC designator ( e3 )can be found on the outer packaging for this package.Note:In the event the full Microchip part number cannot be marked on one line, it willbe carried over to the next line, thus limiting the number of availablecharacters for customer-specific information.DS21293C-page 18© 2007 Microchip Technology Inc.

MCP30018-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]Note:For the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packagingNNOTE 1E11 2 3DEAA2A1Lcb1beeBUnitsINCHESDimension Limits MIN NOM MAXNumber of Pins N 8Pitch e .100 BSCTop to Seating Plane A – – .210Molded Package Thickness A2 .115 .130 .195Base to Seating Plane A1 .015 – –Shoulder to Shoulder Width E .290 .310 .325Molded Package Width E1 .240 .250 .280Overall Length D .348 .365 .400Tip to Seating Plane L .115 .130 .150Lead Thickness c .008 .010 .015Upper Lead Width b1 .040 .060 .070Lower Lead Width b .014 .018 .022Overall Row Spacing § eB – – .430Notes:1. Pin 1 visual index feature may vary, but must be located with the hatched area.2. § Significant Characteristic.3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.4. Dimensioning and tolerancing per ASME Y14.5M.BSC: Basic Dimension. Theoretically exact value shown without tolerances.Microchip Technology Drawing C04-018B© 2007 Microchip Technology Inc. DS21293C-page 19

MCP30018-Lead Plastic Small Outline (SN) – Narrow, 3.90 mm Body [SOIC]Note:For the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packagingDNeEE1NOTE 11 2 3bhhαAA2φcA1LL1βUnitsMILLMETERSDimension Limits MIN NOM MAXNumber of Pins N 8Pitch e 1.27 BSCOverall Height A – – 1.75Molded Package Thickness A2 1.25 – –Standoff § A1 0.10 – 0.25Overall Width E 6.00 BSCMolded Package Width E1 3.90 BSCOverall Length D 4.90 BSCChamfer (optional) h 0.25 – 0.50Foot Length L 0.40 – 1.27Footprint L1 1.04 REFFoot Angle φ 0° – 8°Lead Thickness c 0.17 – 0.25Lead Width b 0.31 – 0.51Mold Draft Angle Top α 5° – 15°Mold Draft Angle Bottom β 5° – 15°Notes:1. Pin 1 visual index feature may vary, but must be located within the hatched area.2. § Significant Characteristic.3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.4. Dimensioning and tolerancing per ASME Y14.5M.BSC: Basic Dimension. Theoretically exact value shown without tolerances.REF: Reference Dimension, usually without tolerance, for information purposes only.Microchip Technology Drawing C04-057BDS21293C-page 20© 2007 Microchip Technology Inc.

MCP30018-Lead Plastic Micro Small Outline Package (MS) [MSOP]Note:For the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packagingDNE1ENOTE 11 2ebAA2cφA1L1LUnitsMILLIMETERSDimension Limits MIN NOM MAXNumber of Pins N 8Pitch e 0.65 BSCOverall Height A – – 1.10Molded Package Thickness A2 0.75 0.85 0.95Standoff A1 0.00 – 0.15Overall Width E 4.90 BSCMolded Package Width E1 3.00 BSCOverall Length D 3.00 BSCFoot Length L 0.40 0.60 0.80Footprint L1 0.95 REFFoot Angle φ 0° – 8°Lead Thickness c 0.08 – 0.23Lead Width b 0.22 – 0.40Notes:1. Pin 1 visual index feature may vary, but must be located within the hatched area.2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.3. Dimensioning and tolerancing per ASME Y14.5M.BSC: Basic Dimension. Theoretically exact value shown without tolerances.REF: Reference Dimension, usually without tolerance, for information purposes only.Microchip Technology Drawing C04-111B© 2007 Microchip Technology Inc. DS21293C-page 21

MCP30018-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]Note:For the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packagingDNEE1NOTE 1b1 2eAA2cφA1L1LUnitsMILLIMETERSDimension Limits MIN NOM MAXNumber of Pins N 8Pitch e 0.65 BSCOverall Height A – – 1.20Molded Package Thickness A2 0.80 1.00 1.05Standoff A1 0.05 – 0.15Overall Width E 6.40 BSCMolded Package Width E1 4.30 4.40 4.50Molded Package Length D 2.90 3.00 3.10Foot Length L 0.45 0.60 0.75Footprint L1 1.00 REFFoot Angle φ 0° – 8°Lead Thickness c 0.09 – 0.20Lead Width b 0.19 – 0.30Notes:1. Pin 1 visual index feature may vary, but must be located within the hatched area.2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.3. Dimensioning and tolerancing per ASME Y14.5M.BSC: Basic Dimension. Theoretically exact value shown without tolerances.REF: Reference Dimension, usually without tolerance, for information purposes only.Microchip Technology Drawing C04-086BDS21293C-page 22© 2007 Microchip Technology Inc.

MCP3001APPENDIX A:REVISION HISTORYRevision C (January 2007)This revision includes updates to the packagingdiagrams.© 2007 Microchip Technology Inc. DS21293C-page 23

NOTES:DS21293C-page 24© 2007 Microchip Technology Inc.

MCP3001PRODUCT IDENTIFICATION SYSTEMTo order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.Device:PART NO. X /XXDeviceTemperatureRangePackageMCP3001: 10-Bit Serial A/D ConverterMCP3001T: 10-Bit Serial A/D Converter(Tape and Reel) (SOIC and TSSOP only)Temperature Range: I = -40°C to +85°CExamples:a) MCP3001-I/P: Industrial Temperature,PDIP package.b) MCP3001-I/SN: Industrial Temperature,SOIC package.c) MCP3001-I/ST: Industrial Temperature,TSSOP package.d) MCP3001-I/MS: Industrial Temperature,MSOP package.Package: P = Plastic DIP (300 mil Body), 8-leadSN = Plastic SOIC (150 mil Body), 8-leadMS = Plastic Micro Small Outline (MSOP), 8-leadST = Plastic TSSOP (4.4 mm), 8-lead© 2007 Microchip Technology Inc. DS21293C-page25

MCP3001NOTES:DS21293C-page26© 2007 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:• Microchip products meet the specification contained in their particular Microchip Data Sheet.• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in theintended manner and under normal conditions.• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to ourknowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s DataSheets. Most likely, the person doing so is engaged in theft of intellectual property.• Microchip is willing to work with the customer who is concerned about the integrity of their code.• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does notmean that we are guaranteeing the product as “unbreakable.”Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of ourproducts. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.Information contained in this publication regarding deviceapplications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS ORIMPLIED, WRITTEN OR ORAL, STATUTORY OROTHERWISE, RELATED TO THE INFORMATION,INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY ORFITNESS FOR PURPOSE. Microchip disclaims all liabilityarising from this information and its use. Use of Microchipdevices in life support and/or safety applications is entirely atthe buyer’s risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchipintellectual property rights.TrademarksThe Microchip name and logo, the Microchip logo, Accuron,dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,PRO MATE, PowerSmart, rfPIC, and SmartShunt areregistered trademarks of Microchip Technology Incorporatedin the U.S.A. and other countries.AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,SEEVAL, SmartSensor and The Embedded Control SolutionsCompany are registered trademarks of Microchip TechnologyIncorporated in the U.S.A.Analog-for-the-Digital Age, Application Maestro, CodeGuard,dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,In-Circuit Serial Programming, ICSP, ICEPIC, Linear ActiveThermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit,PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,rfPICDEM, Select Mode, Smart Serial, SmartTel, TotalEndurance, UNI/O, WiperLock and ZENA are trademarks ofMicrochip Technology Incorporated in the U.S.A. and othercountries.SQTP is a service mark of Microchip Technology Incorporatedin the U.S.A.All other trademarks mentioned herein are property of theirrespective companies.© 2007, Microchip Technology Incorporated, Printed in theU.S.A., All Rights Reserved.Printed on recycled paper.Microchip received ISO/TS-16949:2002 certification for its worldwideheadquarters, design and wafer fabrication facilities in Chandler andTempe, Arizona, Gresham, Oregon and Mountain View, California. TheCompany’s quality system processes and procedures are for its PIC ®MCUs and dsPIC DSCs, KEELOQ ® code hopping devices, SerialEEPROMs, microperipherals, nonvolatile memory and analogproducts. In addition, Microchip’s quality system for the design andmanufacture of development systems is ISO 9001:2000 certified.© 2007 Microchip Technology Inc. DS21293C-page 27

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