ANSYS Icepak - Figes.com.tr

Product Features• IGES, STEP• <strong>ANSYS</strong> ® DesignModeler export to<strong>ANSYS</strong> <strong>Icepak</strong> objects• Support for <strong>ANSYS</strong> Geometry Interfaceswith <strong>ANSYS</strong> DesignModelerAutomatic Mesh Generation• Automatic hex-dominant meshing fortrue geometry representation– Automatic multi-level meshing– 2-D and 3-D cut cell techniques– Automatic non-conformal regions– Robust meshing of CAD geometry• Unstructured hexahedral meshing• Cartesian meshing• Non-conformal regions• Embedded non-conformal meshing• Extruded meshes for packages andboards• Coarse mesh option for first-pass analysis• Mesh quality evaluation toolsBoundary Conditions• Temperature, heat flux, convective heattransfer coefficient, radiation, symmetryand periodic boundary conditions forwalls and surfaces• Inlet and outlet velocity, mass flow rate,outlet static pressure, inlet total pressure,inlet temperature and turbulenceparameters for openings and vents• Profiles of velocity, temperature, heatflux and heat transfer coefficients onopenings and walls• Grilles and resistances with automaticloss coefficient based on free area ratio• Fans with options for mass flow rate orfan performance curve• Rotational speed for cylindrical andcircular objects• Recirculating boundary conditions forexternal heat exchangers• Time-dependent and enhancedtemperature-dependent sources• Time-varying ambient temperature• Automatic correlation-based heattransfer coefficient boundary conditions• Time-dependent pressure• Electric current and voltage• Power map import from IC package andPCB design tools• Transient boundary condition importfrom spreadsheetselectronic trace and via information can all be imported into a thermalsimulation. Using the trace and via information, a detailed thermalconductivity map of the board can be <strong>com</strong>puted based on the coppercontent of the board layers. This allows the engineer to accuratelyrepresent the orthotropic thermal material properties of the board,which provides an increased fidelity in the prediction of the internaltemperatures and <strong>com</strong>ponent junction temperatures. Resistive heatingin the individual traces carrying significant current can be modeled tofurther increase the accuracy of simulations.Multi-level hex-dominant mesh(“hanging-node”) of a heat sinkand fan assembly representeddirectly as a CAD geometryTemperature contours on a 272-pinball grid array (BGA) package on asubstrateDetailed and Compact Thermal Models for IC Packages<strong>ANSYS</strong> <strong>Icepak</strong> includes options for both detailed and <strong>com</strong>pact thermalmodeling of IC packages. Based on electronic CAD data from EDAlayout tools, users can import information such as substrate tracesand vias, bond wires, solder bumps, die dimensions and solder ballsinto a detailed thermal model of an IC package. Using the substratetrace and via information, detailed thermal conductivity maps forthe package substrate can be developed to accurately represent theorthotropic thermal material properties of the substrate. From adetailed package model, <strong>ANSYS</strong> <strong>Icepak</strong> contains an automated processfor DELPHI package characterization (JEDEC <strong>com</strong>pliant). The optimizedDELPHI network model can easily be included in a system-level thermalsimulation, which allows the engineer to accurately predict junctiontemperatures of IC <strong>com</strong>ponents.Flexible Automatic Meshing Technology<strong>ANSYS</strong> <strong>Icepak</strong> contains advanced meshing algorithms to automaticallygenerate high-quality grids that represent the true shape of electronic<strong>com</strong>ponents. Options include hex-dominant, unstructured hexahedraland Cartesian meshing, which enable the engineer to automaticallygenerate body-fitted meshes with minimal intervention. The user canlocalize the mesh density through nonconformal mesh interfaces,which allows the inclusion of a variety of <strong>com</strong>ponent scales within thesame electronics cooling model. While fully automated, <strong>ANSYS</strong> <strong>Icepak</strong>also contains many mesh controls that enable the customizationof meshing parameters to refine the mesh and optimize trade-offsbetween <strong>com</strong>putational cost and solution accuracy. The meshingflexibility of <strong>ANSYS</strong> <strong>Icepak</strong> offers the fastest solution times possiblewithout <strong>com</strong>promising solution accuracy.