ims chips
ims chips
ims chips
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Si Technology Division• Silicon Processing• Development of ultra-thin <strong>chips</strong>• Add-on processingSi Technology• 750 m 2 class 1-10 cleanroom (with an additional 450 m 2 in construction)• Manufacture of integrated circuits on 6 inch wafers, 0.5 and 0.8 µm CMOSprocessing, chip assembly for ceramic packaging, COB and bare dies• Individual processing, wafer processing, Add-on processing12 IMS Overview 2010© IMS 2009
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