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Business News<br />

European industries fall in<br />

the Q1 2005 chip ranking<br />

Europe's Infineon Technologies AG,<br />

STMicroelectronics NV and Philips<br />

Semiconductors lost ground in the semiconductor<br />

market in the first quarter of 2005 in contrast to the<br />

success of Japanese rivals Renesas Technology<br />

Corp. and Toshiba Corp., according to figures from<br />

market research company iSuppli Corp. The overall<br />

market registered $56.99 billion in the first quarter,<br />

3.1 percent down on the $58.79 billion chip sales<br />

iSuppli estimated for the fourth quarter of 2004.<br />

Infineon lost two ranking places to sixth, ST lost two<br />

places to rank seventh and Philips swapped the<br />

ninth spot for the number ten spot with Freescale<br />

Semiconductor. No reasoning was given for<br />

Europe's poor performance, by iSuppli, although<br />

the relative strength of the euro in a dollar-denominated<br />

industry will have played a part.<br />

http://www.isuppli.com<br />

Semiconductors<br />

IBM plans to cut more than 10,000 position, mostly in Europe<br />

IBM plans to cut between 10,000 and 13,000 positions worldwide and to reorganize its management structure.<br />

The changes will mostly affect IBM's European operations and will result in a charge of between $1.3 billion<br />

and $1.7 billion in the second quarter this year and "yield benefits" in the second half of the year, said the<br />

company.<br />

The restructuring was expected following Big Blue's disappointing first-quarter 2005 earnings.<br />

http://www.ibm.com<br />

Suss MicroTec extends its<br />

wafer probe with its Multi IZI<br />

Probe ®<br />

Techno News<br />

SUSS MicroTec AG has extended their wafer probe<br />

range to include the Multi IZI Probe, offering up to<br />

eight independent RF transmission lines with 50 Ohm<br />

impedance.<br />

The probe can be individually configured with RF and<br />

DC contacts for mixed-mode testing of RF and DC<br />

components using one wafer probe. For full flexibility,<br />

other electrical components and even integrated circuits<br />

can also be placed directly on the probe. To<br />

ensure perfect contact at every touchdown, the SUSS<br />

Multi IZI Probe is made with long contact springs that<br />

move independently from one another. The precise<br />

contact quality also makes the Multi IZI Probe highly<br />

reliable, according to the company.<br />

http://www.suss.com<br />

EV Group installs mask aligner<br />

tool at SiTek Electro<br />

Optics<br />

EV Group (EVG), a leading global supplier of waferbonding<br />

and lithography equipment, has added<br />

Sweden´s SiTek Electro Optics to its customer base<br />

with the installation of an EVG620 fully automated, cassette-to-cassette,<br />

double-side mask aligner. SiTek has<br />

designed, manufactured and sold state-of-the-art position-sensing<br />

detectors (PSDs) since 1976. The company´s<br />

PSDs are opto-electronic devices that convert incident<br />

light spots into continuous position data.<br />

http://www.evgroup.com<br />

Leica Microsystems<br />

exceeds expectations for<br />

mask metrology equipment<br />

Leica Microsystems reports strong demand for its<br />

new LWM9000 SEM CD measurement system for<br />

the 65 nm technology node. During the past year,<br />

well-known photomask manufacturers in the semiconductor<br />

industry have ordered nine systems.<br />

Another five systems are set for delivery, with Asian<br />

countries currently representing the biggest market<br />

for Leica Microsystems’ semiconductor equipment<br />

division.<br />

In the same time, the company appoints two new<br />

Sales Managers for the Microelectronic Inspection<br />

Equipment (MIE) business unit in Wetzlar,<br />

Germany: Thomas Breser and Maarten Kramer.<br />

http://www.leica-microsystems.com<br />

IMEC announces research<br />

advances in sub-45-nm<br />

Together with its CMOS core partners, IMEC will<br />

announce several research breakthroughs in new<br />

gate-stack technologies and multiple-gate FET<br />

(MuGFET) devices at the 2005 Symposium on<br />

VLSI Technology. A combination of advances in<br />

MuGFETs and gate-stack technology paired with<br />

lithography improvements also resulted in a new<br />

record for a fully working 6-transistor SRAM cell<br />

of just 0.274µm 2 in area.<br />

http://www.imec.be<br />

Today, more than 10,000 readers trust Yole Développement through Micronews!<br />

July 2005 - n° 38 25

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