Bosch Process
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Business News<br />
European industries fall in<br />
the Q1 2005 chip ranking<br />
Europe's Infineon Technologies AG,<br />
STMicroelectronics NV and Philips<br />
Semiconductors lost ground in the semiconductor<br />
market in the first quarter of 2005 in contrast to the<br />
success of Japanese rivals Renesas Technology<br />
Corp. and Toshiba Corp., according to figures from<br />
market research company iSuppli Corp. The overall<br />
market registered $56.99 billion in the first quarter,<br />
3.1 percent down on the $58.79 billion chip sales<br />
iSuppli estimated for the fourth quarter of 2004.<br />
Infineon lost two ranking places to sixth, ST lost two<br />
places to rank seventh and Philips swapped the<br />
ninth spot for the number ten spot with Freescale<br />
Semiconductor. No reasoning was given for<br />
Europe's poor performance, by iSuppli, although<br />
the relative strength of the euro in a dollar-denominated<br />
industry will have played a part.<br />
http://www.isuppli.com<br />
Semiconductors<br />
IBM plans to cut more than 10,000 position, mostly in Europe<br />
IBM plans to cut between 10,000 and 13,000 positions worldwide and to reorganize its management structure.<br />
The changes will mostly affect IBM's European operations and will result in a charge of between $1.3 billion<br />
and $1.7 billion in the second quarter this year and "yield benefits" in the second half of the year, said the<br />
company.<br />
The restructuring was expected following Big Blue's disappointing first-quarter 2005 earnings.<br />
http://www.ibm.com<br />
Suss MicroTec extends its<br />
wafer probe with its Multi IZI<br />
Probe ®<br />
Techno News<br />
SUSS MicroTec AG has extended their wafer probe<br />
range to include the Multi IZI Probe, offering up to<br />
eight independent RF transmission lines with 50 Ohm<br />
impedance.<br />
The probe can be individually configured with RF and<br />
DC contacts for mixed-mode testing of RF and DC<br />
components using one wafer probe. For full flexibility,<br />
other electrical components and even integrated circuits<br />
can also be placed directly on the probe. To<br />
ensure perfect contact at every touchdown, the SUSS<br />
Multi IZI Probe is made with long contact springs that<br />
move independently from one another. The precise<br />
contact quality also makes the Multi IZI Probe highly<br />
reliable, according to the company.<br />
http://www.suss.com<br />
EV Group installs mask aligner<br />
tool at SiTek Electro<br />
Optics<br />
EV Group (EVG), a leading global supplier of waferbonding<br />
and lithography equipment, has added<br />
Sweden´s SiTek Electro Optics to its customer base<br />
with the installation of an EVG620 fully automated, cassette-to-cassette,<br />
double-side mask aligner. SiTek has<br />
designed, manufactured and sold state-of-the-art position-sensing<br />
detectors (PSDs) since 1976. The company´s<br />
PSDs are opto-electronic devices that convert incident<br />
light spots into continuous position data.<br />
http://www.evgroup.com<br />
Leica Microsystems<br />
exceeds expectations for<br />
mask metrology equipment<br />
Leica Microsystems reports strong demand for its<br />
new LWM9000 SEM CD measurement system for<br />
the 65 nm technology node. During the past year,<br />
well-known photomask manufacturers in the semiconductor<br />
industry have ordered nine systems.<br />
Another five systems are set for delivery, with Asian<br />
countries currently representing the biggest market<br />
for Leica Microsystems’ semiconductor equipment<br />
division.<br />
In the same time, the company appoints two new<br />
Sales Managers for the Microelectronic Inspection<br />
Equipment (MIE) business unit in Wetzlar,<br />
Germany: Thomas Breser and Maarten Kramer.<br />
http://www.leica-microsystems.com<br />
IMEC announces research<br />
advances in sub-45-nm<br />
Together with its CMOS core partners, IMEC will<br />
announce several research breakthroughs in new<br />
gate-stack technologies and multiple-gate FET<br />
(MuGFET) devices at the 2005 Symposium on<br />
VLSI Technology. A combination of advances in<br />
MuGFETs and gate-stack technology paired with<br />
lithography improvements also resulted in a new<br />
record for a fully working 6-transistor SRAM cell<br />
of just 0.274µm 2 in area.<br />
http://www.imec.be<br />
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July 2005 - n° 38 25