Bosch Process
Bosch Process
Bosch Process
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Life & Death<br />
STMicroelectronics<br />
specifies restructuring plans<br />
in Europe<br />
STMicroelectronics, during a meeting of its<br />
European Work Council, specified the restructuring<br />
efforts, already announced in May, to recover profitability,<br />
after the disappointing results of first quarter<br />
2005. In addition to the prior measures, the<br />
Company has presented principles of the initiatives<br />
which will bring the cumulative reduction of its workforce<br />
in Europe - out of a total of 3,000 outside Asia<br />
- to 2,300 jobs by mid-2006, including the non renewal<br />
of some temporary positions.<br />
The company plans to reorganise its European activities<br />
by:<br />
converting 6 inch production tools to 8 inches, in<br />
pursuit of the programme already undertaken<br />
optimising on a global scale its EWS activities<br />
(wafer test)<br />
harmonising its support functions, reducing its costs<br />
and rationalising its activities (outside of manufacturing)<br />
Disengaging from certain activities<br />
This project must now be submitted to the workers<br />
representatives in each of the countries involved.<br />
http://www.st.com<br />
Semiconductors<br />
Conferences September 27 and 28 2005, Europole Grenoble<br />
Attractive Programme of Conferences Is Now Ready! (6 sessions and 32 papers)<br />
“From MICROPACKAGING to MICROSYSTEMS BGA and INTERCONNEXION<br />
PACKAGING of MICROSYSTEMS”<br />
Opening session dedicated to the R&D on Interconnection and Packaging in France<br />
and in Europe.<br />
Session 1- Lead free assembly.(BGA LF, assembly processes…)<br />
Session 2- Microsystems and Advanced Packaging (Mems, wafer level and 3D processes…)<br />
Part 1<br />
Session 3-Characterization and reliability.(characterisation of materials…)<br />
Session 4- Microsystems and Advanced Packaging (continued).(different applications<br />
of chip size packaging…) Part 2.<br />
Session 5-Interconnection process.<br />
Posters presentation.<br />
For complete programme, registration form or receiving invitation card,<br />
please visit our website www.imapsfrance.org or call 33 (0) 1 39 67 17 73<br />
STEAG HamaTec expands<br />
activities in Austin, TX<br />
STEAG HamaTech USA, Inc., a wholly owned subsidiary<br />
of the STEAG HamaTech parent company<br />
located in Sternenfels, Germany, will be expanding<br />
its presence in Austin with an initiative to strengthen<br />
USA infrastructure capabilities for installed base<br />
customer support for photomask process equipment,<br />
as well as product development for niche<br />
wafer applications. Target wafer markets include<br />
300mm Advanced Packaging photolithography processes<br />
for coat, bake, and develop, as well as supplemental<br />
wafer bump wet processes.<br />
http://www.steag-hamatech.com<br />
Atmel intends to sell its<br />
Nantes, France semicondutor<br />
fab<br />
Atmel Corporation, a global leader in the development<br />
and fabrication of advanced semiconductor<br />
solutions, announced its intention to sell its semiconductor<br />
manufacturing facility in Nantes, France. The<br />
Atmel facility, owned since 1998, is a 6-inch wafer fab<br />
with a current production capacity of 2500 wafers per<br />
week. It manufactures semiconductors in BiCMOS,<br />
CMOS and non-volatile technologies in line widths<br />
down to 0.5 microns and is 0.35 micron-capable.<br />
http://www.atmel.com<br />
Today, more than 10,000 readers trust Yole Développement through Micronews!<br />
July 2005 - n° 38 26
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