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2 The scaling of MOSFETs, Moore's law, and ITRS

2 The scaling of MOSFETs, Moore's law, and ITRS

2 The scaling of MOSFETs, Moore's law, and ITRS

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<strong>The</strong> <strong>scaling</strong> <strong>of</strong> <strong>MOSFETs</strong>, Moore’s <strong>law</strong>, <strong>and</strong> <strong>ITRS</strong> Chapter 2continued to be defined as 70% dimension reduction per node or approximately 50%reduction per two nodes. <strong>The</strong> “technology-node-cycle” is the period <strong>of</strong> time in which anew technology node is introduced.In addition to the <strong>scaling</strong> <strong>of</strong> the gate length, the oxide thickness is anothercritical parameter, which has been aggressively scaled down in order to achieve asufficient drive current <strong>and</strong> to control short channel effect. <strong>The</strong> later can be achieved bymaintaining the electrostatic control <strong>of</strong> the channel potential by the gate.Figure 2:4 shows the technology half pitch (hp) <strong>and</strong> gate length trends adoptedin the <strong>ITRS</strong>’03 edition. Beyond year 2007 the two year cycle delays by another year <strong>and</strong>is expected to be three years until the end the present roadmap projection time-line <strong>and</strong>probably beyond. <strong>The</strong> physical gate length is conventionally adapted as minimumfeature size regarding the individual devices.1000DRAM ½ PitchMPU Physical L gMPU/ASIC ½ PitchMPU Printed L gDimension [nm]100102 year cycle 3 year cycle1199219962000200420082012Year <strong>of</strong> production20162020Figure 2:4 Technology half-pitch <strong>and</strong> gate length trends.16

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