Franz Bechtold - VIA electronic
Franz Bechtold - VIA electronic
Franz Bechtold - VIA electronic
You also want an ePaper? Increase the reach of your titles
YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.
… Outlook on the Future of Cera mics and Ceramic Microsyste ms:<br />
LTCC Business: Technology Driver versus Market Domain<br />
Market Do m ain<br />
Entertainment<br />
Consumer<br />
Information Technologie<br />
Telecom<br />
Automotive<br />
Industrial Equipment<br />
Military/Aerospace<br />
Main Technology Drivers<br />
Cost, Size<br />
Cost, Size<br />
Cost, Integration Density, Reliability<br />
Costs, Integration Density, Reliability<br />
Costs, Reliability, Weight,<br />
Feasability, Costs, Reliability<br />
IMAPS/ACerS 2 nd International Conference on Ceramic Interconnect<br />
and Ceramic Microsystem Technologies, Denver, April 24 – 27, 2006<br />
<strong>Franz</strong> <strong>Bechtold</strong>, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
Reliability, Integration Density, Weight, Costs
Change language