Franz Bechtold - VIA electronic
Franz Bechtold - VIA electronic
Franz Bechtold - VIA electronic
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… Outlook on the Future of Cera mics and Ceramic Microsyste ms:<br />
Overview<br />
• Introduction: <strong>VIA</strong> <strong>electronic</strong>, Historical Bricks<br />
Interoduction: Ceramic Technologies in Electronic Applications<br />
LTCC Business: Ups and Downs, Success and Failures, Market<br />
Relevance, Technology Drivers,<br />
• State of the art: LTCC vs. PCB and Si, Large and S mall companies<br />
• LTCC perspectives: Sm art Components, Integrated Passives, Wafer<br />
level Packaging, Opto<strong>electronic</strong>s integration, Biofluidics<br />
• Conclusion: Risk and O p portunities<br />
IMAPS/ACerS 2 nd International Conference on Ceramic Interconnect<br />
and Ceramic Microsystem Technologies, Denver, April 24 – 27, 2006<br />
<strong>Franz</strong> <strong>Bechtold</strong>, <strong>VIA</strong> <strong>electronic</strong> GmbH
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