Franz Bechtold - VIA electronic
Franz Bechtold - VIA electronic
Franz Bechtold - VIA electronic
You also want an ePaper? Increase the reach of your titles
YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.
… Outlook on the Future of Cera mics and Ceramic Microsyste ms:<br />
LTCC outlook: Emerging Market Opportunities and challanges<br />
Opportunity<br />
Biotechnology and<br />
che mical sensors<br />
Heterogeneous<br />
System Integration<br />
System in Package<br />
M E M S Packaging<br />
MOEMS<br />
Packaging<br />
Challange<br />
Lab on Chip, integrated fluidic,<br />
integrated reactors and sensors<br />
High pin count, QFP, LGA, B G A,<br />
functionalintegration<br />
3D interconnection, passive<br />
integration, thermal management<br />
3D integration, hermeticity, Wafer<br />
level packaging<br />
Integration of optical and<br />
electrical conductors/components<br />
IMAPS/ACerS 2 nd International Conference on Ceramic Interconnect<br />
and Ceramic Microsystem Technologies, Denver, April 24 – 27, 2006<br />
<strong>Franz</strong> <strong>Bechtold</strong>, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
Technical Requirements<br />
C he mical performance<br />
Biocompatibility<br />
Flatness, TCE matching of<br />
Ceramic to PC B,<br />
New and adapted<br />
materials, new and adepted<br />
processe<br />
TCE matching of Ceramic<br />
to Si, no XY shrinkage<br />
no XY shrinkage, excellent<br />
planarity and accuracy
Change language