Franz Bechtold - VIA electronic
Franz Bechtold - VIA electronic
Franz Bechtold - VIA electronic
Create successful ePaper yourself
Turn your PDF publications into a flip-book with our unique Google optimized e-Paper software.
… Outlook on the Future of Cera mics and Ceramic Microsyste ms:<br />
Introduction: Ceramic Technologies and their Applications<br />
Ceramic Technologies and Application Do m ains in Electronics<br />
• Thickfilm on Alumina: Industrial, Auto m otive, Military, Aerospace, Medical<br />
• DCB on Alumina: Automotive, Industrial Equip m ent<br />
• Thickfilm on AlN: Military and Aerospace<br />
• DCB on AlN: Military and Aerospace<br />
• Thinfilm on Alumina: Military, Aerospace, Teleco m, Industrial Equipment<br />
• Thinfilm on AlN: Telecom, Military, Aerospace, Medical, Industrial<br />
• Alumina/HTC C/Thickfilm: Telecom, Military, Aerospace, Medical, Industrial<br />
• AlN/HTCC/Thickfilm: Military, Aerospace<br />
• LTCC/Thickfilm : Automotive, Telecom, Industrial, Medical, Military,<br />
Aerospace<br />
IMAPS/ACerS 2 nd International Conference on Ceramic Interconnect<br />
and Ceramic Microsystem Technologies, Denver, April 24 – 27, 2006<br />
<strong>Franz</strong> <strong>Bechtold</strong>, <strong>VIA</strong> <strong>electronic</strong> GmbH
Change language