ASIC SA-27E Databook, Part 1: Base Library and I/Os - CSAIL People

SA-27E
Product Summary
Product Offerings
Table 4. In-line Wire Bond Die/Package Menu: TFBGA 1 (Multiple Supply)
Max Signal I/O for Die-Package Combination
0.80 mm pitch TFBGA
1.2 mm max height
14 x 14 mm: 220 total balls 180 180 180 180 180
14 x 14 mm: 192 total balls 156 156 156 156 156 156 156
Product Overview
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12 x 12 mm: 180 total balls 144 144 144 144 144 144 144
12 x 12 mm: 160 total balls 132 132 132 132 132 132 132 132
10 x 10 mm: 112 total balls 88 88 88 88 88 88 88 88 88
Max Signal I/O for Die-Package Combination
0.50 mm pitch TFBGA
1.2 mm max height
12 x 12 mm: 220 total balls 180 180 180 180 180
10 x 10 mm: 180 total balls 144 144 144 144 144 144
8 x 8 mm: 132 total balls 104 104 104 104 104 104
8 x 8 mm: 96 total balls 80 80 80 80 80 80
Die Metal Layers Wirable Gates 4 (Thousands) for Die-Size Metal Layer Combinations
4 334 508 609 837 965 1248 1403 1740 1923 2315 2524 2971 3207 3708 3973 4528 4819 5429 5747
5 430 592 695 956 1100 1430 1600 1990 2200 2650 2890 3400 3670 4240 4540 5180 5510 6210 6570
6 430 654 783 1080 1240 1580 1720 2110 2340 2810 3070 3610 3890 4500 4830 5500 5850 6590 6980
1. TFBGA is a custom offering. Contact your IBM representative for information.
2. In-line wire bond footprint, 67.20 μm pitch.
3. Package height is measured from seating plane to highest point on top surface of plastic body.
4. Actual usable gate count varies depending on the design content.
5. TFBGA package offerings shown support core and four additional power zones.
6. TFBGA package offerings are JEDEC level 3 moisture sensitivity. TFBGA package offerings shown are reliability grade 3.
7. Contact your IBM representative for additional and most up-to-date information, including custom offerings.
SA14-2208-03
June 4, 2001