ASIC SA-27E Databook, Part 1: Base Library and I/Os - CSAIL People

Table 11. Peripheral C4 Plastic Flip Chip Die-Package Menu: FC-PBGA
1.27 mm pitch FC-PBGA Max Signal I/O for Die-Package Combination
42.5 x 42.5 mm: 1088 total balls 648 704 728 728 704
40 x 40 mm: 960 total balls 536 592 648 640 640 640 592
SA14-2208-03
June 4, 2001
37.5 x 37.5 mm: 840 total balls 536 572 572 532 532
35 x 35 mm: 728 total balls 424 480 491 451 451 451
33 x 33 mm: 624 total balls 312 368 416 416 400 400
27 x 27 mm: 399 total balls 256 260 260 260
1.00 mm pitch FC-PBGA Max Signal I/O for Die-Package Combination
42.5 x 42.5 mm: 1680 total balls 760 816 872
40 x 40 mm: 1520 total balls 648 704 760 816 872
37.5 x 37.5 mm: 1295 total balls 592 648 704 760 816 788
35 x 35 mm: 1155 total balls 480 536 592 648 704 720 720
33 x 33 mm: 1023 total balls 424 480 536 592 648 624
27 x 27 mm: 675 total balls 256 312 368 424 432 432
Die Metal Layers Wirable Gates 1 (Millions) for Die-Size Metal Layer Combinations
5 1.50 2.076 2.745 3.508 4.364 5.314 6.357 7.493 8.723 10.05 11.46 12.97 14.58 16.27 18.06 19.95 21.92
6 1.55 2.14 2.84 3.59 4.45 5.41 6.46 7.61 8.85 10.18 11.60 13.12 14.73 16.44 18.24 20.13 22.12
1. Actual usable gate count varies depending on the design content.
2. FC-PBGA package offerings support core and four additional power zones.
3. FC-PBGA package offerings are JEDEC level 4 moisture sensitivity. FC-PBGA package offerings are reliability grade 3.
4. Max Tj = 115°C.
5. Up to eight on-package 47 nF decoupling capacitors can be supported.
6. The FC-PBGA package is only available with a lid.
7. Contact your IBM representative for additional and most up-to-date information, including custom offerings.
SA-27E
Product Summary
Product Offerings
Product Overview
45