ASIC SA-27E Databook, Part 1: Base Library and I/Os - CSAIL People

SA-27E
Product Summary
Product Offerings
Table 10. Staggered Wire Bond Die-Package Menu: HPBGA (Multiple Supply)
Max Signal I/O for Die-Package Combination
Ball
Rows
1.27 mm pitch HPBGA (2S2P)
31 mm x 31 mm: 304 total balls 4 228 228 228 228 228 2 228 2
45 x 45 mm: 580 total balls 5 436
Product Overview
44
42.5 x 42.5 mm: 540 total balls 5 404 404 404 404 2 404 2
40 x 40 mm: 520 total balls 5 392 392 392 392 392 392 2 392 2
37.5 x 37.5 mm: 480 total balls 5 360 360 360 360 360 360 2 360 2 360 2 360 2
35 x 35 mm: 420 total balls 5 316 316 316 316 316 316 316 316 2 316 2
Max Signal I/O for Die-Package Combination
Ball
Rows
1.00 mm pitch HPBGA (2S2P)
40 mm x 40 mm: 560 total balls 4 420
37.5 mm x 37.5 mm: 512 total balls 4 392 392 392 392 392 392 2 392 2
35 mm x 35 mm: 480 total balls 4 360 360 360 360 360 360 360 2 360 2 360 2
31 mm x 31 mm: 416 total balls 4 316 316 316 316 316 316 316 316 2 316 2 316 2 316 2 316 2 316 2
27 mm x 27 mm: 352 total balls 4 268 268 268 268 268 268 2 268 2
35 mm x 35 mm: 580 total balls 5 436
31 mm x 31 mm: 500 total balls 5 384 384 384 384 384 384 384
27 mm x 27 mm: 420 total balls 5 316 316 316 316 316
Die Metal Layers Wirable Gates 3 (Thousands) for Die-Size Metal Layer Combinations
5 846 1084 1259 1546 1754 2089 2330 2715 2988 3422 3727 4210 4549 5081 5452
6 967 1240 1440 1770 2000 2390 2660 3100 3420 3910 4260 4810 5200 5810 6230
1. Staggered wire bond footprint, 40.32 μm effective pitch.
2. Custom offering. Contact your IBM representative for more information.
3. Actual usable gate count varies depending on the design content.
4. HPBGA package offerings shown support core and four additional power zones.
5. HPBGA package offerings are JEDEC level 3 moisture sensitivity. HPBGA package offerings are reliability grade 3.
6. Contact your IBM representative for additional and most up-to-date information.
SA14-2208-03
June 4, 2001