Seja bem vindo a Nanotech Alemanha - Nano in Germany

Principal Office
Fraunhofer IZM - Chemnitz Branch of the Institute
Multi Device Integration
Reichenhainer Strasse 88
D-09126 Chemnitz
Germany
Phone: (+)49 - 37 15 31 24 062
Fax: (+)49 - 37 15 31 24 069
E-Mail: info@che.izm.fraunhofer.de
Web: www.pb.izm.fraunhofer.de/mdae
Contact Person
Prof. Dr. Thomas GESSNER
Vice Director Fraunhofer IZM
Phone: (+)49 - 37 15 31 24 060
Fax: (+)49 - 37 15 31 24 069
E-Mail: thomas.gessner@che.izm.fraunhofer.de
The department Multi Device Integration was founded in 1998 and is located in Chemnitz,
Saxony. Its basic fields are the development of Micro-(Nano)-Electro-Mechanical-Systems
(MEMS), technologies and equipment for manufacturing MEMS in silicon and other materials.
Further research fields are back-end-of-line technologies for future micro and nano electronics,
printed electronic systems for ubiquitous low-cost applications and investigation of micro and
nano reliability for smart systems. In near future Microsystems will be quite more
multifunctional e. g. the integrated combination of electronics for signal and information
processing with sensors and actuators in silicon and nonsilicon technologies. The so called multi
device integration to smaller and smarter systems is our vision.
Main Research Activities:
Design and Development of MEMS
• MEMS design and modelling
• Sensors, actuators, and electronics (e. g. acceleration sensors, gyroscopes, scanner)
• Transducer and analyzer systems (i. e. spectrometer, ultra sonic)
• Measurement and characterization
Back-End-of-Line BEOL
• Spin-on dielectrics, Air Gap structures, and integration of low-k dielectrics
• Copper interconnect metallization systems (e.g. 45nm pitches) and diffusion barriers,
• Scaling effects, reliability, modelling and simulation
Development of Advanced Technologies
• 3D-patterning, deep silicon etching and wire, chip and wafer bonding technologies,
• Chemical mechanical planarization (CMP)
• MEMS Packaging at wafer level
Micro and Nano Reliability
• Reliability for Microsystems e. g. for Automotive and IT applications
• Combination of Reliability, Miniaturization and Microsecurity
• Thermomechanical Simulation and Reliability for Nanoelectronics
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