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emaining following assembly.<br />
Light extraction from the OLED device<br />
is a primary concern for increasing OLED<br />
panel efficiency and luminaire efficacy. In<br />
conventional OLEDs, it is estimated that<br />
only 20% of the generated light exits the<br />
OLED due to refractive index mismatch 12 .<br />
Films that redirect light between the<br />
substrate and the electrode can be used to<br />
enhance light output. Photonic crystals can<br />
provide improved coupling to enable light<br />
to exit the OLED.<br />
OLED printing processes<br />
SMT assembly makes use of various<br />
printing and deposition processes in the<br />
production of electronic products, e.g.,<br />
solder paste screen printing, conformal<br />
coating, conductive adhesive dispensing,<br />
etc. Printing technologies for OLED<br />
technology embrace a number of printing<br />
technologies that move beyond the typical<br />
SMT space. The ability to print many of<br />
the materials that <strong>com</strong>prise an OLED SSL<br />
device makes such fabrication a <strong>com</strong>pelling<br />
value proposition.<br />
The OLED substrate will determine<br />
whether R2R or sheet fed processes will<br />
be feasible. Rigid glass substrate systems<br />
require sheet fed processes, while flexible<br />
substrates such as polymer and metal<br />
foils can be used with either process.<br />
While R2R printing produces long sheets<br />
of OLED material the OLED devices<br />
still need to be excised from the web.<br />
Depending upon the manufacturing<br />
flow and subsequent processing steps,<br />
sheet fed printing that produces near-net<br />
final shapes may be as cost effective as<br />
R2R printing with its subsequent slitting<br />
and excising steps. Engineering analysis<br />
is required to determine the optimum<br />
system.<br />
OLED printing techniques can be<br />
differentiated by the method they use to<br />
feed the substrate to the printing process.<br />
R2R processes print on long continuous<br />
material films, while sheet fed printing<br />
uses individual sheets in discrete sizes.<br />
Relative to sheet fed processes, R2R<br />
processes minimize the load/un-load time<br />
between printing stations. However, sheet<br />
fed processes can be made to mimic R2R<br />
printing with inline techniques.<br />
A simplified R2R process flow for<br />
producing an OLED light source is<br />
depicted in Figure 7 13 . In this schematic<br />
diagram, the transparent substrate is<br />
printed with the anode layer and then<br />
successive layers of functional inks are<br />
in-line printed to produce the OLED<br />
structure. For white light production,<br />
red, green and blue emissive layers can<br />
www.globalsmtindia.in<br />
Figure 7. Schematic of a R2R OLED printing<br />
process.<br />
Figure 9. Left—Osram ORBEOS product. Right—Philips Lumiblade product.<br />
be printed, but if a single light color is<br />
required then only printing that ink would<br />
be necessary. White light can also be<br />
produced by printing a blue light emissive<br />
layer and adding a phosphor layer that<br />
converts the blue light to white light,<br />
which is similar to crystalline LED SSL<br />
practices. Within this basic process flow<br />
numerous permutations are possible to<br />
address cost effective manufacturing. The<br />
encapsulation and <strong>com</strong>pleted module steps<br />
will be discussed in later sections.<br />
Gravure, flexographic and slot-die<br />
coating processes can be used to print or<br />
coat the inks to produce an OLED device.<br />
An alternative to these printing processes<br />
are inkjet printing processes. While the<br />
first three processes require contract<br />
between dispensing equipment and the<br />
substrate, inkjet printing is a non-contact<br />
process. Inkjet printing processes have<br />
been developed for fabricating OLED<br />
displays 14 , Figure 8. An OLED suitable<br />
for SSL applications could be simpler to<br />
produce since it would not require the<br />
polysilicon TFT and the pixel sizes could<br />
be larger.<br />
Screen-printing technology (which<br />
is an SMT staple) uses a masked screen<br />
to determine the location where the ink<br />
will be deposited. With both flat bed<br />
and rotary machines available, it has<br />
wide applicability because it can print<br />
on many types of surfaces and substrates<br />
Printed electronics for flexible solid-state lighting<br />
Figure 8. Schematic of an inkjet OLED printing<br />
process.<br />
and is <strong>com</strong>patible with a wide range of<br />
ink viscosities. It is suitable for printing<br />
relatively thick layers to produce electrical<br />
conductors and dielectric layers. These<br />
are required: a) to produce interconnects<br />
between the OLED light engine and power<br />
sources, b) to generate printed bus bars to<br />
bring electrical power to the OLED pixels,<br />
c) to provide conductors for control lines<br />
to offer unique features and d) to provide<br />
insulating layers where appropriate. Bus<br />
bars and interconnect conductors can be<br />
formed from silver or carbon inks. Silver<br />
inks have higher conductivity while carbon<br />
is lower cost. Bus bars and interconnect<br />
lines must be positioned so that they offer<br />
the lowest shadowing effects.<br />
OLED encapsulation processes<br />
In an OLED SSL device, the OLED light<br />
source generates the light (Assembly Level<br />
1 and 2) while the light engine (Assembly<br />
Level 2) enables it to couple to the<br />
luminaire. Assembly Level 2 must provide<br />
the light engine environmental protection<br />
(e.g., humidity resistance, oxygen<br />
resistance, etc.) and physical protection<br />
(e.g., abrasion resistance, etc.). Assembly<br />
Level 2 also provides the opportunity for<br />
improving light extraction.<br />
Printed OLEDs are thin structures<br />
with electrodes on the top and bottom<br />
surfaces. Since the separation distance<br />
between the electrodes is small and the<br />
Global SMT & Packaging <strong>South</strong>east <strong>Asia</strong> – Winter 2010 – 17