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Tin Whisker Electrical Short Circuit Characteristics ... - NEPP - Nasa

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48 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, VOL. 32, NO. 1, JANUARY 2009<br />

A. Future Work<br />

There are many aspects of the tin whisker phenomena that<br />

provide opportunities for future research. One area that would<br />

expand on the research performed here would be to study the effect<br />

of pressure on breakdown voltage. This would require the<br />

development of a method measuring pressure applied to the tin<br />

whisker either directly or indirectly by measuring whisker deflection,<br />

length and diameter and then calculating the pressure.<br />

Expanding the range of the power beyond the 0–45 Vdc to<br />

determine the upper limit of breakdown voltage would also provide<br />

additional insight. By expanding the upper limit one may<br />

be able to eliminate the censored data points.<br />

Other variables that could affect tin whisker shorting should<br />

also be studied. Some examples of these variables that warrant<br />

future study include whisker shape, whisker length and thickness,<br />

and oxidation layer thickness. Another phenomenon related<br />

to tin whiskers that warrants further quantification is metal<br />

vapor arcing.<br />

ACKNOWLEDGMENT<br />

The authors would like to thank Dr. H. Leidecker of NASA<br />

and J. Brusse of Perot Systems at Goddard Space Flight Center<br />

for sharing their vast knowledge on the topic of tin whiskers,<br />

and taking the time to answer the many questions posed<br />

throughout this experiment. The authors would also like to<br />

thank Z. Rahman with the Materials Characterization Facility,<br />

AMPAC, University of Central Florida (UCF), for his expertise<br />

in FIB and TEM analysis, M. Spates, P. Marciniak, S. Loucks,<br />

J. Neihoff, P. Richiuso, and R. King of NASA Kennedy Space<br />

Center for their help with the fabrication/modification of the test<br />

equipment, L. Batterson of NASA Kennedy Space Center for<br />

his expertise in photography, A. Oliu of NASA Johnson Space<br />

Center for his expertise with digital imaging, Dr. L. Keller of<br />

NASA Johnson Space Center and Dr. J. Lomness of NASA<br />

Kennedy Space Center for reviewing the diffraction patterns,<br />

Dr. S. Smith of NASA and Dr. R. N. Shenoy of Lockheed<br />

Martin at NASA Langley Research Center for indexing the<br />

diffraction patterns, and M. Madden of United Space Alliance<br />

for his expertise with breakdown voltage selection software.<br />

REFERENCES<br />

[1] G. T. Galyon, “Annotated tin whisker bibliography and anthology,”<br />

IEEE Trans. Electron. Packag. Manuf., vol. 28, no. 1, pp. 94–122, Jan.<br />

2005.<br />

[2] J. Brusse, G. Ewell, and J. Siplon, “<strong>Tin</strong> whiskers: Attributes and mitigation,”<br />

in Proc. Capacitor and Resistor Technol. Symp., 2002, pp.<br />

67–80.<br />

[3] H. Leidecker and J. Brusse, “<strong>Tin</strong> whiskers: A history of documented<br />

electrical system failures—A briefing,” Space Shuttle Program<br />

Office, 2006 [Online]. Available: http://nepp.nasa.gov/whisker/reference/tech_papers/2006-Leidecker-<strong>Tin</strong>-<strong>Whisker</strong>-Failures.pdf.<br />

[4] K. J. Courey, S. S. Asfour, J. A. Bayliss, L. L. Ludwig, and M. C.<br />

Zapata, “<strong>Tin</strong> whisker electrical short circuit characteristics—Part I,”<br />

IEEE Trans. Electron. Packag. Manuf., vol. 31, no. 1, pp. 32–40, Jan.<br />

2008.<br />

[5] T. Fang, “<strong>Tin</strong> whisker risk assessment studies,” DAI-B, 2005, vol.<br />

66(12) [Online]. Available: https://drum.umd.edu/dspace/handle/<br />

1903/3079<br />

[6] R. D. Hilty and N. E. Corman, “<strong>Tin</strong> whisker reliability assessment by<br />

Monte Carlo simulation,” in Proc. IPC/JEDEC Lead-Free Symp., 2005,<br />

pp. 1–8.<br />

[7] EasyFit. [Electronic] Mathwave Technologies, 2007, vol. 3.2 [Online].<br />

Available: http://www.mathwave.com/products/easyfit.html<br />

[8] I. A. Koutrouvelis, G. C. Canavos, and S. G. Meintanis, “Estimation in<br />

the three-parameter inverse Gaussian distribution,” in Comput. Statist.<br />

Data Anal., Jun. 15, 2005, vol. 49, pp. 1132–1147.<br />

[9] “Minitab Release 14 Statistical Software,” Minitab Inc., 2003 [Online].<br />

Available: http://www.minitab.com/products/<br />

[10] K. Takagi, S. Kumagai, C. Matsunaga, and Y. Kusaka, “Application<br />

of inverse Gaussian distribution to occupational exposure data,” The<br />

Annals of Occupational Hygiene, vol. 41, pp. 505–514, Oct. 1997.<br />

[11] “Standard Test Methods for Determining Average Grain Size,” American<br />

Society for Testing and Materials, ASTM International, West Conshohocken,<br />

PA, 2006 [Online]. Available: www.astm.org.<br />

[12] R. Schetty, “Electrodeposited tin properties & their effect on component<br />

finish reliability,” in Proc. 2004 Int. Conf. Business of Electron.<br />

Product Reliability and Liability, 2004, pp. 29–34.<br />

[13] J. Smetana, “Minimizing tin whiskers,” SMT Surface Mount Technol.<br />

Mag., vol. 19, pp. 36–38, 2005.<br />

[14] M. Osterman, in Proc. Mitigation Strategies for <strong>Tin</strong> <strong>Whisker</strong>s, Jul. 3,<br />

2002, vol. 2006.<br />

Karim J. Courey received the B.E.E. degree from Cleveland State University,<br />

Cleveland, OH, in 1986, the M.B.A. degree from the Florida Institute of Technology,<br />

Melbourne, FL, in 1993, and the Ph.D. degree in industrial engineering<br />

from the University of Miami, Coral Gables, FL, in 2008.<br />

He is currently a Principal Engineer with the Orbiter Sustaining Engineering<br />

Office for the National Aeronautics and Space Administration, Lyndon B.<br />

Johnson Space Center, Texas. His duty location is at the John F. Kennedy<br />

Space Center in Florida.<br />

Dr. Courey is a licensed Professional Engineer in the state of Texas.<br />

Shihab S. Asfour received the B.S. and M.S. degrees in production engineering<br />

from Alexandria University, Alexandria, Egypt, in 1973 and 1976, respectively,<br />

and the Ph.D. degree in industrial engineering and psychology from Texas Tech<br />

University, Lubbock, in 1980.<br />

He is currently Professor and Associate Dean of the College of Engineering at<br />

the University of Miami, Coral Gables, FL. He has over 30 years of instructional,<br />

professional and research experience and has authored over 200 publications.<br />

He has 17 recent publications in both biomechanical and industrial engineering<br />

and has also supervised 18 Ph.D. dissertations.<br />

Arzu Onar received the B.S. degree in mathematical sciences at the University<br />

of North Carolina, Chapel Hill, in 1993 and the M.S. and Ph.D. degrees<br />

in statistics from University of South Carolina, Columbia, in 1995 and 1998,<br />

respectively.<br />

She is currently a faculty member at the Biostatistics Department, St. Jude<br />

Children’s Research Hospital, Memphis, TN. Her research interests are in statistical<br />

reliability and in survival analysis.<br />

Jon A. Bayliss received the A.S. degree in computer engineering technology<br />

from Tampa Technical Institute, Tampa, FL, in 1979, and the B.S. degree in<br />

electrical engineering from the Florida Institute of Technology, Melbourne, in<br />

1986.<br />

He is currently an <strong>Electrical</strong> Engineer in the Electronic Failure Analysis Section,<br />

Engineering Directorate for the National Aeronautics and Space Administration,<br />

Kennedy Space Center, FL.<br />

Lawrence L. Ludwig received the B.S. degree in electrical engineering from<br />

the Florida Institute of Technology, Melbourne, in 1986 and the M.S. degree<br />

in engineering management from the University of Central Florida, Orlando, in<br />

1992.<br />

He is currently a Lead <strong>Electrical</strong> Engineer in Electronic Failure Analysis Section,<br />

Engineering Directorate for the National Aeronautics and Space Administration,<br />

Kennedy Space Center, FL.<br />

Maria C. Wright received the B.S. degree in materials science and engineering<br />

from the University of Florida, Gainesville, in 2002 and the M.S. degree in materials<br />

science and engineering from the Pennsylvania State University, University<br />

Park, in 2005.<br />

She is currently a Materials Engineer in the Materials Failure Analysis Section,<br />

Engineering Directorate for the National Aeronautics and Space Administration<br />

at Kennedy Space Center, FL.<br />

Authorized licensed use limited to: University of Maryland College Park. Downloaded on January 12, 2009 at 16:34 from IEEE Xplore. Restrictions apply.

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