I C™ Serial EEPROM Family Data Sheet - Microchip

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24AAXX/24LCXX/24FCXX 8-Lead Plastic Small Outline (SN) – Narrow, 3.90 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging NOTE 1 A A1 N D 1 2 3 b e E1 A2 E Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 8 Pitch e 1.27 BSC Overall Height A – – 1.75 Molded Package Thickness A2 1.25 – – Standoff § A1 0.10 – 0.25 Overall Width E 6.00 BSC Molded Package Width E1 3.90 BSC Overall Length D 4.90 BSC Chamfer (optional) h 0.25 – 0.50 Foot Length L 0.40 – 1.27 Footprint L1 1.04 REF Foot Angle φ 0° – 8° Lead Thickness c 0.17 – 0.25 Lead Width b 0.31 – 0.51 Mold Draft Angle Top α 5° – 15° Mold Draft Angle Bottom β 5° – 15° Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. φ DS21930C-page 30 © 2007 Microchip Technology Inc. h L L1 h α β c Microchip Technology Drawing C04-057B
24AAXX/24LCXX/24FCXX 8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging NOTE 1 N 1 2 D TOP VIEW A3 A1 Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 8 Pitch e 0.50 BSC Overall Height A 0.80 0.90 1.00 Standoff A1 0.00 0.02 0.05 Contact Thickness A3 0.20 REF Overall Length D 2.00 BSC Overall Width E 3.00 BSC Exposed Pad Length D2 1.30 – 1.75 Exposed Pad Width E2 1.50 – 1.90 Contact Width b 0.18 0.25 0.30 Contact Length L 0.30 0.40 0.50 Contact-to-Exposed Pad K 0.20 – – Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package may have one or more exposed tie bars at ends. 3. Package is saw singulated. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. E A EXPOSED PAD NOTE 2 2 1 D2 NOTE 1 © 2007 Microchip Technology Inc. DS21930C-page 31 L K b e BOTTOM VIEW N E2 Microchip Technology Drawing C04-123B
Page 1 and 2: Features: • 128-bit through 1024
Page 3 and 4: TABLE 1-1: DEVICE SELECTION TABLE (
Page 5 and 6: 24AAXX/24LCXX/24FCXX TABLE 2-2: AC
Page 7 and 8: 24AAXX/24LCXX/24FCXX TABLE 2-3: AC
Page 9 and 10: 3.0 PIN DESCRIPTIONS The descriptio
Page 11 and 12: 5.0 BUS CHARACTERISTICS The followi
Page 13 and 14: 5.6 Device Addressing For Devices W
Page 15 and 16: 5.7.1 CONTIGUOUS ADDRESSING ACROSS
Page 17 and 18: 6.2 Page Write The write control by
Page 19 and 20: 8.0 READ OPERATION Read operations
Page 21 and 22: APPENDIX A: REVISION HISTORY Revisi
Page 23 and 24: Device Line 1 Marking 8-Lead SOIC X
Page 25 and 26: Device 8-Lead DFN Example: XXXXXXX
Page 27 and 28: 8-Lead MSOP (150 mil) Example: Devi
Page 29: 8-Lead Plastic Dual In-Line (P) - 3
Page 33 and 34: 5-Lead Plastic Small Outline Transi
Page 35 and 36: 24AAXX/24LCXX/24FCXX 8-Lead Plastic
Page 37 and 38: THE MICROCHIP WEB SITE Microchip pr
Page 39 and 40: PRODUCT IDENTIFICATION SYSTEM 24AAX
Page 41 and 42: Note the following details of the c

I C™ Serial EEPROM Family Data Sheet - Microchip

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