I C™ Serial EEPROM Family Data Sheet - Microchip

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24AAXX/24LCXX/24FCXX 8-Lead Plastic Micro Small Outline Package (MS) [MSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging NOTE 1 A A1 N 1 2 b D e E1 A2 E c L1 L Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 8 Pitch e 0.65 BSC Overall Height A – – 1.10 Molded Package Thickness A2 0.75 0.85 0.95 Standoff A1 0.00 – 0.15 Overall Width E 4.90 BSC Molded Package Width E1 3.00 BSC Overall Length D 3.00 BSC Foot Length L 0.40 0.60 0.80 Footprint L1 0.95 REF Foot Angle φ 0° – 8° Lead Thickness c 0.08 – 0.23 Lead Width b 0.22 – 0.40 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-111B DS21930C-page 34 © 2007 Microchip Technology Inc. φ
24AAXX/24LCXX/24FCXX 8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging NOTE 1 A A1 b N 1 2 D e A2 E1 c E Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 8 Pitch e 0.65 BSC Overall Height A – – 1.20 Molded Package Thickness A2 0.80 1.00 1.05 Standoff A1 0.05 – 0.15 Overall Width E 6.40 BSC Molded Package Width E1 4.30 4.40 4.50 Molded Package Length D 2.90 3.00 3.10 Foot Length L 0.45 0.60 0.75 Footprint L1 1.00 REF Foot Angle φ 0° – 8° Lead Thickness c 0.09 – 0.20 Lead Width b 0.19 – 0.30 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. © 2007 Microchip Technology Inc. DS21930C-page 35 L1 L φ Microchip Technology Drawing C04-086B
Page 1 and 2: Features: • 128-bit through 1024
Page 3 and 4: TABLE 1-1: DEVICE SELECTION TABLE (
Page 5 and 6: 24AAXX/24LCXX/24FCXX TABLE 2-2: AC
Page 7 and 8: 24AAXX/24LCXX/24FCXX TABLE 2-3: AC
Page 9 and 10: 3.0 PIN DESCRIPTIONS The descriptio
Page 11 and 12: 5.0 BUS CHARACTERISTICS The followi
Page 13 and 14: 5.6 Device Addressing For Devices W
Page 15 and 16: 5.7.1 CONTIGUOUS ADDRESSING ACROSS
Page 17 and 18: 6.2 Page Write The write control by
Page 19 and 20: 8.0 READ OPERATION Read operations
Page 21 and 22: APPENDIX A: REVISION HISTORY Revisi
Page 23 and 24: Device Line 1 Marking 8-Lead SOIC X
Page 25 and 26: Device 8-Lead DFN Example: XXXXXXX
Page 27 and 28: 8-Lead MSOP (150 mil) Example: Devi
Page 29 and 30: 8-Lead Plastic Dual In-Line (P) - 3
Page 31 and 32: 24AAXX/24LCXX/24FCXX 8-Lead Plastic
Page 33: 5-Lead Plastic Small Outline Transi
Page 37 and 38: THE MICROCHIP WEB SITE Microchip pr
Page 39 and 40: PRODUCT IDENTIFICATION SYSTEM 24AAX
Page 41 and 42: Note the following details of the c

I C™ Serial EEPROM Family Data Sheet - Microchip

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