Comparison of Thin-Film Aluminum Deposition - Berkeley Microlab

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OBJECTIVE

To compare thin-film aluminum deposition

using:

1) Resistivity

2) Uniformity

3) Deposition Rate

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OBJECTIVE To compare thin-film aluminum deposition using: 1) Resistivity 2) Uniformity 3) Deposition Rate

OUTLINE OF PROJECT - Cleaning Wafers & Oxide Growth - Sputtering - Novellus m2i Sputtering System - Edwards Auto 306DC and RF Sputter Coater -CPA Sputtering System -Evaporating - NRC Evaporator - Veeco 401 Vaccum System - Edwards eb3 Electron Beam Evaporator - Photolithography & Etching

Page 1: UC BERKELEY MICROFABRICATION LAB IN
Page 5 and 6: CLEANING WAFERS & OXIDE GROWTH Sink
Page 7 and 8: EVAPORATING Metal is heated on thro
Page 9 and 10: Wafer Non-Uniformity (%) DATA ANALY
Page 11 and 12: OBSTACLES •When using NRC(1) and
Page 13: ACKNOWLEDGEMNTS • Thank you, Jimm

Comparison of Thin-Film Aluminum Deposition - Berkeley Microlab

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