Contacts for Flip Chip Wafer Level Probing - Semiconductor Wafer ...
Contacts for Flip Chip Wafer Level Probing - Semiconductor Wafer ...
Contacts for Flip Chip Wafer Level Probing - Semiconductor Wafer ...
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2‐Production Qualification Test Flow<br />
Objective: To validate long term stability of probe card / setup<br />
and probe process reliability (Production Worthiness)<br />
MtP Probe Cards<br />
TestCell<br />
# 1<br />
Parallel Test Flow<br />
(Multi-Test Cell<br />
setups)<br />
MtP<br />
CARD<br />
1<br />
TestCell<br />
# 2<br />
LOTS<br />
1A,2A<br />
MtP<br />
CARD<br />
2<br />
LOTS<br />
3A,4A<br />
LOTs<br />
1B,2B<br />
LOTs<br />
3B,4B<br />
100 <strong>Wafer</strong>s<br />
Split 4 Lots<br />
RTP<br />
Input Variables:<br />
• Probe Card to Probe Card<br />
• <strong>Wafer</strong> to <strong>Wafer</strong> (Re‐probe)<br />
• Lot to Lot<br />
Output Variables:<br />
• CRes<br />
• Yield<br />
• Re‐Probe Rate<br />
• TPT<br />
• Bump Scrub Damage<br />
• Planarity/Alignment<br />
• Lifetime/Reliability
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