Contacts for Flip Chip Wafer Level Probing - Semiconductor Wafer ...
Contacts for Flip Chip Wafer Level Probing - Semiconductor Wafer ...
Contacts for Flip Chip Wafer Level Probing - Semiconductor Wafer ...
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C‐VPC vs. MtP: Effect on Bump<br />
C-VPC Flat probes<br />
MtP<br />
MtP<br />
CVPC Flat probes compress or<br />
impact the apex of the bump.<br />
Multi‐tip contacts create small<br />
dimple marks away from the apex<br />
Bump height damage > 1/3 of of bump; not affecting bump<br />
the bump is not desirable. Also, height. The pointed tips better<br />
CRes not as stable thus, more penetrate the bump’s oxide layer,<br />
frequent cleaning to remove resulting in stable CRes using<br />
compacted debris is required.<br />
much lower probe <strong>for</strong>ce.
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