Contacts for Flip Chip Wafer Level Probing - Semiconductor Wafer ...

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Key Learning: “Probe Physics” • The pressure between any two (2) surfaces in contact with each other is a function of force and contact area. Force = Pressure x Contact Area • Multi‐Point tip enables a lower force per probe creating adequate pressure to break into the surface of the bump to make a reliable electrical contact. • To achieve the same effect, the corresponding flat tip of a C‐VPC approach would requires a larger force to collapse the surface oxide of the bump apex • The electrical contact surface area; however is comparable where the sides of the pyramid provide po desufficient surface aea area for electrical conduction. Area 1 Flat Tip C-VPC Area 2 Multi- Point Contact
Summary of MTP Attributes • Self alignment of tips to bump. Well centered • No reflow of bump after probe is required • CRes < C‐VPC • Force/Pin < C‐VPC • Cleaning < C‐VPC • Planarization not required • Cost Of Ownership < C‐VPC (Multi‐Site)
Page 1 and 2: June 12 to 15, 2011 San Diego, CA M
Page 3 and 4: Introduction • Multi-site probing
Page 5 and 6: MtP / FFI-Micro-spring Probe Card T
Page 7 and 8: 1‐Technology Qualification Test F
Page 9 and 10: TQ: Effect of Cleaning Freq. on CRe
Page 11 and 12: Actual MtP Deflection in Test Cell
Page 13 and 14: TQ: MtP vs. CVPC CRes Characterizat
Page 15 and 16: PQ: MtP Production CRes Stability T
Page 17: C‐VPC vs. MtP: Effect on Bump C-V
Page 21: Acknowledgements •Carey Farley

Contacts for Flip Chip Wafer Level Probing - Semiconductor Wafer ...

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