Contacts for Flip Chip Wafer Level Probing - Semiconductor Wafer ...
Contacts for Flip Chip Wafer Level Probing - Semiconductor Wafer ...
Contacts for Flip Chip Wafer Level Probing - Semiconductor Wafer ...
Create successful ePaper yourself
Turn your PDF publications into a flip-book with our unique Google optimized e-Paper software.
1‐Technology Qualification Test Flow<br />
Objective: Define a stable probe / cleaning process and<br />
HW set-up be<strong>for</strong>e volume production qualification phase.<br />
MtP Probe Cards<br />
Re-Probed<br />
#2<br />
8 <strong>Wafer</strong>s<br />
TestCell<br />
# 1<br />
MtP<br />
CARD 1<br />
<strong>Wafer</strong><br />
1<br />
<strong>Wafer</strong><br />
2<br />
MP MtP<br />
CARD 2<br />
<strong>Wafer</strong><br />
2<br />
<strong>Wafer</strong><br />
3<br />
<strong>Wafer</strong><br />
4<br />
Stop <strong>for</strong><br />
Tech Qual<br />
Review<br />
TestCell<br />
# 2<br />
CVPC<br />
CARD<br />
1<br />
Input Variables:<br />
<strong>Wafer</strong><br />
2<br />
• Probe Card to Probe Card<br />
• <strong>Wafer</strong> to <strong>Wafer</strong> (Re‐probe)<br />
<strong>Wafer</strong><br />
3<br />
Control Reference<br />
Output Variables:<br />
• CRes<br />
• Yield<br />
• Re‐Probe Rate<br />
• Throughput<br />
• Bump Scrub Damage<br />
• Planarity/Alignment
Change language