Intel Itanium Processor 9300 Series and 9500 Series

2.14 Test Access Port (TAP) Connection .......................................................................71
3 Pin Listing................................................................................................................73
3.1 Processor Package Bottom Pin Assignments...........................................................73
3.1.1 Package Bottom Pin Listing by Pin Name ....................................................73
3.1.2 Pin Listing by Pin Number ........................................................................89
3.2 Processor Package Top Pin Assignments.............................................................. 105
3.2.1 Top-Side J1 Connector Two-Dimensional Table ......................................... 105
3.2.2 Top-Side J2 Connector Two-Dimensional Table ......................................... 108
3.2.3 Top-Side J3 Connector Two-Dimensional Table ......................................... 111
3.2.4 Top-Side J4 Connector Two-Dimensional Table ......................................... 114
4 Mechanical Specifications ...................................................................................... 119
4.1 Package Mechanical Drawing ............................................................................. 120
4.2 Intel ® Itanium ® Processor 9300 Series............................................................... 121
4.3 Processor Component Keepout Zones ................................................................. 129
4.4 Package Loading Specifications.......................................................................... 129
4.5 Package Handling Guidelines ............................................................................. 129
4.6 Processor Mass Specifications............................................................................ 130
4.7 Processor Materials .......................................................................................... 130
4.8 Package Markings ............................................................................................ 130
5 Thermal Specifications........................................................................................... 133
5.1 Thermal Features............................................................................................. 133
5.1.1 Digital Thermometer ............................................................................. 134
5.1.2 Thermal Management............................................................................ 135
5.1.3 Thermal Alert ....................................................................................... 136
5.1.4 TCONTROL........................................................................................... 137
5.1.5 Thermal Warning .................................................................................. 137
5.1.6 Thermal Trip ........................................................................................ 137
5.1.7 PROCHOT ............................................................................................ 138
5.1.8 FORCEPR_N Signal Pin........................................................................... 138
5.1.9 Ararat Voltage Regulator Thermal Signals ................................................ 138
5.2 Package Thermal Specifications and Considerations .............................................. 139
5.3 Storage Conditions Specifications....................................................................... 140
6 System Management Bus Interface........................................................................ 143
6.1 Introduction.................................................................................................... 143
6.2 SMBus Memory Component............................................................................... 144
6.2.1 Processor Information ROM (PIROM) ....................................................... 144
6.2.2 Scratch EEPROM ................................................................................... 149
6.2.3 PIROM and Scratch EEPROM Supported SMBus Transactions....................... 150
6.3 Memory Component Addressing......................................................................... 150
6.4 PIROM Field Definitions..................................................................................... 152
6.4.1 General ............................................................................................... 152
6.4.2 Processor Data ..................................................................................... 152
6.4.3 Processor Core Data.............................................................................. 152
6.4.4 Processor Uncore Data .......................................................................... 153
6.4.5 Cache Data .......................................................................................... 154
6.4.6 Package Data ....................................................................................... 155
6.4.7 Part Number Data................................................................................. 155
6.4.8 Thermal Reference Data ........................................................................ 155
6.4.9 Feature Data........................................................................................ 156
6.4.10 Other Data .......................................................................................... 157
6.4.11 Checksums .......................................................................................... 157
7 Signal Definitions................................................................................................... 159
4 Intel ® Itanium ® Processor 9300 Series and 9500 Series Datasheet