Control of Pad Damage Using Prober Operational Parameters
Control of Pad Damage Using Prober Operational Parameters
Control of Pad Damage Using Prober Operational Parameters
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Minimum Scrub Volume<br />
One Way Analysis <strong>of</strong> Variance <strong>of</strong> MINIMUM Scrub Volume By Wafer<br />
Scrub Volume<br />
100<br />
90<br />
80<br />
70<br />
60<br />
50<br />
40<br />
30<br />
20<br />
10<br />
1 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24<br />
Wafer<br />
Each Pair<br />
Student's t<br />
0.05<br />
Borderline<br />
Statistically<br />
Significant<br />
Min <strong>Damage</strong><br />
W09<br />
W17<br />
W20<br />
Touchdowns Undertravel Pin-Update Wafer Chuck Speed Chuck Revise Overtravel<br />
20 Single 10 Off High On 50<br />
17 Single 20 On High On 50<br />
9 Single Off Off Low On 50<br />
June 3-6, 3<br />
2007 IEEE SW Test Workshop 26
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