Control of Pad Damage Using Prober Operational Parameters
Control of Pad Damage Using Prober Operational Parameters
Control of Pad Damage Using Prober Operational Parameters
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<strong>Control</strong>ling the <strong>Damage</strong><br />
• The depth <strong>of</strong> the probe mark can be controlled with<br />
modifications to the probe card technology<br />
– Low force probe cards (various manufacturers)<br />
– Optimized probe to pad interactions<br />
• <strong>Prober</strong>s can effectively change the z-stage motion just<br />
before contact and during overtravel to reduce damage<br />
– Variable Speed Probing by Accretech ®<br />
– Micro-Touch by Electroglas ®<br />
– Micro-Force Probing by Tokyo Electron Limited ® (TEL)<br />
June 3-6, 3<br />
2007 IEEE SW Test Workshop 8
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