Control of Pad Damage Using Prober Operational Parameters
Control of Pad Damage Using Prober Operational Parameters
Control of Pad Damage Using Prober Operational Parameters
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Background – Depth Effects<br />
Excessively deep probe marks can cause …<br />
– Underlying layer damage (low-k dielectric, circuitry under bond<br />
pads, and aluminum capped copper pads)<br />
– Bondability and long term reliability issues<br />
Many steps are<br />
needed to<br />
assess cracks.<br />
Images from Hartfield, et al, SWTW-2003<br />
Sources …<br />
Hartfield, et al, SWTW-2003<br />
Martens, et. al., SWTW-2003<br />
Hartfield, et al., SWTW-2004<br />
Stillman, et al., SWTW-2005<br />
Among others …<br />
June 3-6, 3<br />
2007 IEEE SW Test Workshop 6
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