Probing Lead Free Solder Bumps in Final Wafer Test
Probing Lead Free Solder Bumps in Final Wafer Test
Probing Lead Free Solder Bumps in Final Wafer Test
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Microelectronics<br />
Contact Resistance – <strong>Lead</strong> T<strong>in</strong> C4’s<br />
10<br />
Average Contact resistance<br />
PbSn 97/3 UNREFLOWED C4's<br />
Each plot po<strong>in</strong>t = 86K measurements<br />
9<br />
8<br />
7<br />
(OHMS)<br />
6<br />
5<br />
4<br />
-10C<br />
25C<br />
85C<br />
100C<br />
3<br />
2<br />
1<br />
0<br />
6 mils 7 mils 8 mils 9 mils<br />
Contact + Overdrive<br />
Sam McKnight June 2002 Southwest <strong>Test</strong> Workshop<br />
12
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