Probing Lead Free Solder Bumps in Final Wafer Test
Probing Lead Free Solder Bumps in Final Wafer Test
Probing Lead Free Solder Bumps in Final Wafer Test
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Microelectronics<br />
Typical <strong>Wafer</strong> level Contact Resistance<br />
plot for <strong>Lead</strong>/T<strong>in</strong> C4’s<br />
PbSn Basel<strong>in</strong>e Average Contact Resistance/site<br />
6 milOD - temperature -<br />
25C 283 sites/wafer<br />
Note scale<br />
F<strong>in</strong>ish<br />
20<br />
15<br />
10<br />
5<br />
0<br />
Notch<br />
Start<br />
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S. McKnight<br />
B.Budd<strong>in</strong>gton<br />
03/29/01<br />
Sam McKnight June 2002 Southwest <strong>Test</strong> Workshop<br />
20
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