Probing Lead Free Solder Bumps in Final Wafer Test
Probing Lead Free Solder Bumps in Final Wafer Test
Probing Lead Free Solder Bumps in Final Wafer Test
SHOW LESS
You also want an ePaper? Increase the reach of your titles
YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.
Microelectronics<br />
25°C Cobra/C4 Photos<br />
Probe<br />
6 MIL O D<br />
Probe<br />
7 MIL O D<br />
Probe<br />
88 MIL O D<br />
Probe<br />
9 MIL O D<br />
C4 Pad<br />
6 MIL O D<br />
C4 Pad<br />
7 MIL O D<br />
C4 Pad<br />
88 MIL MIL O D<br />
C4 Pad<br />
9 MIL O D<br />
Sam McKnight June 2002 Southwest <strong>Test</strong> Workshop<br />
15
Change language