Probing Lead Free Solder Bumps in Final Wafer Test
Probing Lead Free Solder Bumps in Final Wafer Test
Probing Lead Free Solder Bumps in Final Wafer Test
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Microelectronics<br />
Contact Resistance - <strong>Lead</strong> <strong>Free</strong> C4’s<br />
Note scale<br />
Average Contact resistance<br />
<strong>Lead</strong> <strong>Free</strong><br />
Each plot po<strong>in</strong>t = 86K measurements<br />
1<br />
0.9<br />
0.8<br />
0.7<br />
0.6<br />
-10C<br />
25C<br />
85C<br />
100C<br />
(OHMS)<br />
0.5<br />
0.4<br />
0.3<br />
36 open read<strong>in</strong>gs (500 ohms)<br />
0.2<br />
Sample contam<strong>in</strong>ant<br />
open p<strong>in</strong><br />
0.1<br />
0<br />
6 mils 7 mils 8 mils 9 mils<br />
Contact + Overdrive<br />
Sam McKnight June 2002 Southwest <strong>Test</strong> Workshop<br />
13
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